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Structural, Morphological and Mechanical Property Analysis of TiAlN Thin Film Coating Deposited by CVD Technique

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Recent Advances in Thermofluids and Manufacturing Engineering

Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

Abstract

In this experimental work titanium aluminium nitride (TiAlN) has been successfully synthesized over silicon substrate (p-type c-Si (100)) by chemical vapour deposition (CVD) process. The EDS results confirm presence of residual O2 in coating. Composition wise Ti is found to be maximum followed by Al and N. The morphological analysis by SEM confirms the formation of smooth coating whereas AFM analysis helps to determine the particle size of TiAlN coating. The coating thickness is around 7 µm. XRD analysis confirms the presence (111), (200), (220) and (311) crystal planes. Different nanomechanical properties of TiAlN coating have been determined by nanoindentation process and it has been found that the hardness and Young’s modulus of TiAlN coating are 32.97 and 277.98 GPa, respectively. The data analysis of TiAlN coating has been done by Origin 9.0 software.

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Authors and Affiliations

  1. School of Mechanical Engineering, KIIT University, Bhubaneswar, Odisha, 751024, India

    Spandan Guha

  2. Department of Mechanical Engineering, Sikkim Manipal Institute of Technology, Sikkim Manipal University, Majhitar, Rangpo, 737136, India

    Soham Das

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  1. Spandan Guha
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Correspondence to Spandan Guha .

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Editors and Affiliations

  1. Purdue University, West Lafayette, IN, USA

    Shripad Revankar

  2. Papua New Guinea University of Technology, Lae, Papua New Guinea

    Kamalakanta Muduli

  3. KIIT, Bhubaneswar, India

    Debjyoti Sahu

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Guha, S., Das, S. (2023). Structural, Morphological and Mechanical Property Analysis of TiAlN Thin Film Coating Deposited by CVD Technique. In: Revankar, S., Muduli, K., Sahu, D. (eds) Recent Advances in Thermofluids and Manufacturing Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-19-4388-1_36

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  • DOI: https://doi.org/10.1007/978-981-19-4388-1_36

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-19-4387-4

  • Online ISBN: 978-981-19-4388-1

  • eBook Packages: EngineeringEngineering (R0)

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