Abstract
As a widespread form of dry etching, deep reactive ion etching (DRIE) is a highly anisotropic etch process. It alternates switching the chemistry for etching and passivation cycles, typically leads to characteristic scalloping patterns on the sidewalls with high aspect ratios. Measurements of the etch depth per cycle l d and undercut length per cycle l u show a strong dependence of the undercut ratio l u /l d on the trench aspect ratio for a wide range of opening sizes. Although various simulation models have been proposed, the determination of the corresponding parameters from experimental data remains unsolved. We present the use of (i) the continuous cellular automaton (CCA), to simulate the process reliably in three dimensions; (ii) the particle swarm optimization (PSO) method, to determine suitable values for the atomistic CCA parameters directly from experimental data; and (iii) a GPU, parallel implementation of the CCA, to increase the computational efficiency of the simulations. The resultant, parameter-optimized CCA simulations show good agreement with the experiments. The approach has a large potential for the simulation of other MEMS processes.
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References
Alam S, Dobbie G, Koh YS, Riddle P, Ur Rehman S (2014) Research on particle swarm optimization based clustering: a systematic review of literature and techniques. Swarm Evol Comput 17:1–13
Chienliu C, Yeong-Feng W, Yoshiaki K, Ji-Jheng S, Yusuke K, Chih-Kung L, Kuang-Chong W, Masayoshi E (2005) Etching submicrometer trenches by using the Bosch process and its application to the fabrication of antireflection structures. J Micromech Microeng 15:580
Ertl O, Selberherr S (2010) Three-dimensional level set based Bosch process simulations using ray tracing for flux calculation. Microelectron Eng 87:20–29
Ferrando N, Gosálvez MA (2012) Evolutionary continuous cellular automaton for the simulation of wet etching of quartz. J Micromech Microeng 22:025021
Ferrando N, Gosálvez MA, Cerdá J, Gadea R, Sato K (2011) Octree-based, GPU implementation of a continuous cellular automaton for the simulation of complex, evolving surfaces. Comput Phys Commun 182:628–640
Hernández Encinas A, Hernández Encinas L, Hoya White S, Martín del Rey A, Rodríguez Sánchez G (2007) Simulation of forest fire fronts using cellular automata. Adv Eng Softw 38:372–378
Hong L-S, Shimogaki Y, Komjyama H (2000) Macro/microcavity method and its application in modeling chemical vapor deposition reaction systems. Thin Solid Films 365:176–188
Kennedy J, Eberhart R (1995) Particle swarm optimization. In: Proceedings of IEEE international conference on neural networks, Perth, vol 4, pp 1942–1948
Knizikevičius R (2003) Simulation of inverse reactive ion etching lag. Vacuum 72:53–57
Lai S, Johnson D, Westerman R (2006) Aspect ratio dependent etching lag reduction in deep silicon etch processes. J Vac Sci Technol A 24:1283–1288
Li Y, Gosálvez MA, Pal P, Sato K, Xing Y (2015) Particle swarm optimization-based continuous cellular automaton for the simulation of deep reactive ion etching. J Micromech Microeng 25:450–456
Mita Y, Sugiyama M, Kubota M, Marty F, Bourouina T, Shibata T (2006) Aspect ratio dependent scalloping attenuation in drie and an application to low-loss fiber-optical switches. In: Proceedings of IEEE international conference on micro electro mechanical systems, Istanbul, pp 114–117
Nagel K, Schreckenberg M (1992) A cellular automaton model for freeway traffic. J Phys I 2:2221–2229
Pilliod JE Jr, Puckett EG (2004) Second-order accurate volume-of-fluid algorithms for tracking material interfaces. J Comput Phys 199:465–502
Poli R, Kennedy J, Blackwell T (2007) Particle swarm optimization. Swarm Intell 1:33–57
Ranganathan N, Lee DY, Youhe L, Lo G-Q, Prasad K, Pey KL (2011) Influence of Bosch etch process on electrical isolation of TSV structures. IEEE Trans Components Packag Manufact Technol 1:1497–1507
Rangelow IW (2003) Critical tasks in high aspect ratio silicon dry etching for microelectromechanical systems. J Vac Sci Technol A Vac Surf 21:1550–1562
Saraf I, Goeckner M, Goodlin B, Kirmse K, Overzet L (2011) Mask undercut in deep silicon etch. Appl Phys Lett 98:161502
Shi Y, Eberhart R (1998) A modified particle swarm optimizer. In: Proceedings of IEEE international conference on evolutionary computation, Anchorage, pp 69–73
Shi Y, Liu H, Gao L, Zhang G (2011) Cellular particle swarm optimization inform. Science 181:4460–4493
Tan Y, Zhou R, Zhang H, Li Z (2006) Modeling and simulation of the lag effect in a deep reactive ion etching process. J Micromech Microeng 16(12):2570–2575
Tsujimoto K, Tachi S, Ninomiya K, Suzuki K, Okudaira S, Nishimatsu S (1986) A new side wall protection technique in microwave plasma etching using a chopping method. International conference on solid state devices & materials, Tokyo, pp 229–232
Wang Y, Guo Y, Zhang H (2007) Modeling and simulation of footing effect in DRIE process. IEEE conference on nanotechnology, pp 1135–1138
Weymouth G, Yue DK-P (2010) Conservative volume-of-fluid method for free-surface simulations on Cartesian-grids. J Comput Phys 229:2853–2865
Xing Y, Gosalvez MA (2007) Step flow-based cellular automaton for the simulation of anisotropic etching of complex MEMS structures. New J Phys 9:436
Yuan L, Yan X, Gosalvez MA, Pal P, Zhou Y (2013) Particle swarm optimization of model parameters: simulation of deep reactive ion etching by the continuous cellular automaton. In: Proceedings of IEEE international conference on transducers & eurosensors, Barcelona, pp 1087–1090
Zhibo M, Chengyu J, Weizheng Y (2012) A triple-layer protection process for high-aspect-ratio silicon micromachining by DRIE of SOI substrates. J Micromech Microeng 22:055028
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Xing, Y. (2018). Modeling and Simulation of Silicon Dry Etching. In: Huang, QA. (eds) Micro Electro Mechanical Systems. Micro/Nano Technologies. Springer, Singapore. https://doi.org/10.1007/978-981-10-5945-2_2
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DOI: https://doi.org/10.1007/978-981-10-5945-2_2
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