Bio and Nano Packaging Techniques for Electron Devices

Advances in Electronic Device Packaging

  • Gerald Gerlach
  • Klaus-Jürgen Wolter

Table of contents

  1. Front Matter
    Pages i-xii
  2. Future of Packaging

    1. Front Matter
      Pages 1-1
    2. Gerald Gerlach
      Pages 3-30
    3. Klaus-Jürgen Wolter
      Pages 31-48
  3. 3D Modelling and Design for NEMS

    1. Front Matter
      Pages 77-77
    2. Jens Lienig
      Pages 79-96
    3. Robert Fischbach
      Pages 97-118
  4. Nanoparticles and Confined Nanosystems

  5. Nanopatterning for NEMS

    1. Front Matter
      Pages 177-177
    2. Wolf-Joachim Fischer, Michael Mertig
      Pages 179-208
    3. Robert Kirchner, Jonathan Derix, Andreas Nocke, René Landgraf
      Pages 209-242
    4. Steffen Howitz, Thomas Wegener
      Pages 243-267
    5. Martin Waegner
      Pages 269-277
    6. Alexander Türke
      Pages 293-303
    7. Andreas Nocke, Marcus Wolf
      Pages 305-318

About this book


The book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their opportunities for packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed and also shows ways for implementation. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces are demonstrated. Also new packaging technologies with high potential for industrial applications like nano partical fabrication and application, nano imprinting and ink-jet printing are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest nano and bio techniques in packaging.


3D Modelling Bio-Functionalized Surfaces Biocompatible Packaging MEMS MOEMS Metallization NEMS Nano-Functionalized Surfaces Nanoparticles Nanopattering Thermal Management

Editors and affiliations

  • Gerald Gerlach
    • 1
  • Klaus-Jürgen Wolter
    • 2
  1. 1.Fak. Elektrotechnik, Inst. FestkörperelektronikTU DresdenDresdenGermany
  2. 2.Fak. Elektrotechnik und, InformationstechnikTU DresdenDresdenGermany

Bibliographic information

  • DOI
  • Copyright Information Springer-Verlag Berlin Heidelberg 2012
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Chemistry and Materials Science
  • Print ISBN 978-3-642-28521-9
  • Online ISBN 978-3-642-28522-6
  • About this book