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Bio and Nano Packaging Techniques for Electron Devices

Advances in Electronic Device Packaging

  • Gerald Gerlach
  • Klaus-Jürgen Wolter

Table of contents

  1. Front Matter
    Pages i-xii
  2. Future of Packaging

    1. Front Matter
      Pages 1-1
    2. Gerald Gerlach
      Pages 3-30
    3. Klaus-Jürgen Wolter
      Pages 31-48
  3. 3D Modelling and Design for NEMS

    1. Front Matter
      Pages 77-77
    2. Jens Lienig
      Pages 79-96
    3. Robert Fischbach
      Pages 97-118
  4. Nanoparticles and Confined Nanosystems

  5. Nanopatterning for NEMS

    1. Front Matter
      Pages 177-177
    2. Wolf-Joachim Fischer, Michael Mertig
      Pages 179-208
    3. Robert Kirchner, Jonathan Derix, Andreas Nocke, René Landgraf
      Pages 209-242
    4. Steffen Howitz, Thomas Wegener
      Pages 243-267
    5. Martin Waegner
      Pages 269-277
    6. Alexander Türke
      Pages 293-303
    7. Andreas Nocke, Marcus Wolf
      Pages 305-318
    8. Juliane Posseckardt, Michael Mertig
      Pages 319-334
  6. Nano- and Bio-Functionalized Surfaces

    1. Front Matter
      Pages 335-335
    2. Gerhard Rödel, Wolfgang Pompe
      Pages 337-353
    3. Jakob Schweizer, Matthias Garten, Petra Schwille
      Pages 383-418
    4. Melinda Varga, Nuriye Korkmaz
      Pages 419-426
    5. Jens Friedrichs, Anna Taubenberger, Susanne Wegmann, David A. Cisneros, Clemens Franz, Daniel J. Müller
      Pages 427-441
  7. Biocompatible Materials and Packaging

    1. Front Matter
      Pages 443-443
    2. Richard H. W. Funk
      Pages 445-471
    3. Jonathan Derix, Srikanth Perike
      Pages 473-489
    4. Jürgen Uhlemann, Robert Kirchner, Klaus-Jürgen Wolter
      Pages 491-514
    5. Nataliia Beshchasna
      Pages 515-522
  8. System-in-Package for MEMS, Bio-MEMS and MOEMS

    1. Front Matter
      Pages 523-523
    2. Maik Müller, Klaus-Jürgen Wolter
      Pages 525-537
    3. Tobias Schuster, René Landgraf, Andreas Finn, Michael Mertig
      Pages 557-579
    4. Christian Schmidt
      Pages 581-599
    5. Jörg Hertwig, Holger Neubert, Jens Lienig
      Pages 601-620
  9. Back Matter
    Pages 621-628

About this book

Introduction

The book offers a comprehensive discussion of future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes effects of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their opportunities for packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed and also shows ways for implementation. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces are demonstrated. Also new packaging technologies with high potential for industrial applications like nano partical fabrication and application, nano imprinting and ink-jet printing are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers as well as practicing engineers seeking information about the latest nano and bio techniques in packaging.

Keywords

3D Modelling Bio-Functionalized Surfaces Biocompatible Packaging MEMS MOEMS Metallization NEMS Nano-Functionalized Surfaces Nanoparticles Nanopattering Thermal Management

Editors and affiliations

  • Gerald Gerlach
    • 1
  • Klaus-Jürgen Wolter
    • 2
  1. 1.Fak. Elektrotechnik, Inst. FestkörperelektronikTU DresdenDresdenGermany
  2. 2.Fak. Elektrotechnik und, InformationstechnikTU DresdenDresdenGermany

Bibliographic information