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Effect of Kinetics of Adhesive Curing on Process-Induced Strains and Stresses in the Metal Composite Joint

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Smart Technologies in Urban Engineering (STUE 2023)

Abstract

Currently adhesive metal composite joints based on polymer adhesives play an important role in the production and repair of structures of various applications. However, adhesive bonding during assembly of structural elements from composites and metals results in process-induced (residual) stresses arising in elements of the joint. The nature and level of such stresses depend on physico-mechanical, thermo-elastic and geometric parameters of the bonded materials, adhesive film and kinetics of the adhesive curing process. The purpose of this study is to develop a mathematical model of the adhesive metal composite joint that integrally takes into account the nature of kinetics of the binder curing. The model suggests obtaining of the empirical dependencies, including the minimum number of constants known from the rated values. Based on this model, we obtained the dependences to determine the strains and stresses in the joint during the adhesive assembly process at all stages of the temperature-time diagram. A critical stage of the temperature-time regime has been identified, with the establishing of unfavorable combinations of the values of binder shrinkage and modulus of elasticity of the adhesive, when the joint may fail during the adhesive assembly or its strength may decrease because of high level of residual stresses. Our findings can be effectively used in the future to optimize the technological processes for the production of metal composite structures with due consideration for the properties of specific binders, reinforcing materials, and geometric parameters of constituent elements.

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Correspondence to Andrii Kondratiev .

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Kondratiev, A., Gaidachuk, O., Vambol, O., Nabokina, T., Kryzhyvets, Y. (2023). Effect of Kinetics of Adhesive Curing on Process-Induced Strains and Stresses in the Metal Composite Joint. In: Arsenyeva, O., Romanova, T., Sukhonos, M., Biletskyi, I., Tsegelnyk, Y. (eds) Smart Technologies in Urban Engineering. STUE 2023. Lecture Notes in Networks and Systems, vol 807. Springer, Cham. https://doi.org/10.1007/978-3-031-46874-2_18

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