Abstract
Designers have to be prepared for the scenario where chips do not work as intended or do not meet performance expectations after they are fabricated. Product yield engineers need to know what has caused their product yield to be below expectation. Reliability engineers need to know what circuits or elements have failed from various stresses and those that are returned by the customers. Debug and diagnosis of chip failures is necessary to find the root cause of these issues, and it is best facilitated if the design has accommodated features for debug and diagnosis.
This chapter focuses on the automated tools and methods along with design features at the architectural, logic, circuit, and layout level that are needed to facilitate silicon debug and defect diagnosis of integrated circuits. These design features are generally referred to as design for debug and diagnosis (DFD). We explain how these DFD features along with automated tools and methods are used effectively in a debug or diagnosis environment for applications ranging from design validation, low yield analysis, and all the way to field failure analysis. This chapter will serve as a steppingstone to understand further how conventional methods for fault diagnosis can be improved using machine learning based techniques in subsequent chapters.
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References
Josephson, D., Poehlman, S., Govan, V.: Debug Methodology for the McKinley Processor. In: IEEE International Test Conference, pp. 451–460 (2001, October)
van Rootselaar, G.J., Vermeulen, B.: Silicon Debug: Scan Chains Alone Are Not Enough. In: IEEE International Test Conference, pp. 892–902 (1999, September)
Gizopoulos, D. (ed.): Advances in Electronic Testing: Challenges and Methodologies Series: Frontiers in Electronic Testing. Springer, Boston (2006)
Gangartikar, P., Presson, R., Rosner, L.: Test/Characterization Procedures for High Density Silicon RAMs. In: IEEE International Solid-State Circuits Conference, pp. 62–63 (1982, May)
Hammond, J., Sery, G.: Knowledge-Based Electrical Monitor Approach Using Very Large Array Yield Structures to Delineate Defects During Process Development and Production Yield Improvement. In: Proceedings of International Workshop on Defect and Fault Tolerance in VLSI, pp. 67–80 (1991, November)
Segal, J., Jee, A., Lepejian, D., Chu, B.: Using Electrical Bitmap Results from Embedded Memory to Enhance Yield. In: IEEE Design and Test of Computers, pp. 28–39 (2001, May–June)
Livengood, R.H., Medeiros, D.: Design for (Physical) Debug for Silicon Microsurgery and Probing of Flip-Chip Packaged Integrated Circuits. In: IEEE International Test Conference, pp. 877–882 (1999, September)
Abramovici, M., Breuer, M.A., Friedman, A.D.: Digital Systems Testing and Testable Design. IEEE Press, Revised Printing, Piscataway (1994)
Bushnell, M.L., Agrawal, V.D.: Essentials of Electronic Testing for Digital, Memory & Mixed-Signal VLSI Circuits. Springer, Boston (2000)
Jha, N., Gupta, S.: Testing of Digital Systems. Cambridge University Press, London (2003)
Wang, L.-T., Wu, C.-W., Wen, X. (eds.): VLSI Test Principles and Architectures: Design for Testability. Morgan Kaufmann, San Francisco (2006)
Guo, R., Venkataraman, S.: An algorithmic technique for diagnosis of faulty scan chains. IEEE Trans. Comput-Aided Des. 25(9), 1861–1868 (2006)
Venkataraman, S., Drummonds, S.B.: Poirot: Applications of a logic fault diagnosis tool. IEEE Des. Test Comput. 18(1), 19–30 (2001)
Waicukauski, J.A., Lindbloom, E.: Failure diagnosis of structured VLSI. IEEE Des. Test Comput. 6(4), 49–60 (1989)
Eichelberger, E.B., Williams, T.W.: A Logic Design Structure for LSI Testability. In: IEEE Design Automation Conference, pp. 462–468 (1977, June)
Hao, H., Avra, R.: Structured Design for Debug - The SuperSPARC-II Methodology and Implementation. In: IEEE International Test Conference, pp. 175–183 (1995, October)
Carbine, A.: Scan Mechanism for Monitoring the State of Internal Signals of a VLSI Microprocessor Chip. U.S. Patent No. 5,253,255 (1993, October 12)
Carbine, A., Feltham, D.: Pentium Pro Processor Design for Test and Debug. In: IEEE International Test Conference, pp. 294–303 (1997, November)
Sogomonyan, E.S., Morosov, A., Gossel, M., Singh, A., Rzeha, J.: Early Error Detection in Systems-on-Chip for Fault-Tolerance and At-Speed debugging. In: IEEE VLSI Test Symposium, pp. 184–189 (2001, April)
IEEE Std. 1149.1-2001: IEEE Standard Test Access Port and Boundary Scan Architecture. IEEE Press, New York (2001)
Abramovici, M., Bradley, P., Dwarakanath, K., Levin, P., Memmi, G., Miller, D.: A Reconfigurable Design-for-Debug Infrastructure for SoCs. In: ACM/IEEE Design Automation Conference, pp. 2–12 (2006, July)
D. C. Pham, T. Aipperspach, D. Boerstler, M. Bolliger, R. Chaudhry, D. Cox, P. Harvey, P. M. Harvey, H. P. Hofstee, C. Johns, J. Kahle, A. Kameyama, J. Keaty, Y. Masubuchi, M. Pham, J. Pille, S. Posluszny, M. Riley, D. L. Stasiak, M. Suzuoki, O. Takahashi, J. Warnock, S. Weitzel, D. Wendel, and K. Yazawa, “Overview of the architecture, circuit design, and physical implementation of a first-generation cell processor,” IEEE J. Solid-State Circuits, Vol. 41, No. 1, pp. 179–196, Jan. 2006.
Kurd, N.A., Barkarullah, J.S., Dizon, R.O., Fletcher, T.D., Madland, P.D.: A Multigigahertz clocking scheme for the Pentium 4 microprocessor. IEEE J Solid State Circuits. 36(11), 1647–1653 (2001)
Fetzer, E.S.: Using adaptive circuits to mitigate process variations in a microprocessor design. IEEE Des. Test Comput. 23(6), 476–483 (2006)
Josephson, D., Gottlieb, B.: The Crazy Mixed up World of Silicon Debug [IC validation]. In: IEEE Custom Integrated Circuits Conference, pp. 665–670 (2004, October)
Mahoney, P., Fetzer, E., Doyle, B., Naffziger, S.: Clock Distribution on a Dual-Core, Multi-Threaded Itanium Family Processor. In: Digest of Papers, IEEE International Solid-State Circuits Conference, pp. 292–599, (2005, February)
Aitken, R.C.: Finding Defects with Fault Models. In: IEEE International Test Conference, pp. 498–505 (1995, October)
Venkataraman, S., Drummonds, S.B.: A Technique for Logic Fault Diagnosis of Interconnect Open Defects. In: IEEE VTS, pp. 313–318 (2000)
Chang, Y.-J., et al.: Experiences with Layout-Aware Diagnosis. In: Electronic Device Failure Analysis (2010, May)
Mekkoth, J., et al.: Yield Learning with Layout-aware Advanced Scan Diagnosis. In: International Symposium of Testing and Failure Analysis (ISTFA) (2006)
Amyeen, M.E., Nayak, D., Venkataraman, S.: Improving Precision Using Mixed-level Fault Diagnosis, IEEE International Test Conference (2006), Paper: 22.3
Tendolkar, N., et al.: Improving Transition Fault Test Pattern Quality through At-Speed Diagnosis. In: ITC (2006)
Gearhardt, K., Schuermyer, C., Guo, R.: Improving Fault Isolation using Iterative Diagnosis. In: 34th International Symposium for Failure Analysis, pp. 390–391 (2008, November 2–6)
Cheng, W.-T., Tsai, K.-H., Huang, Y., Tamarapalli, N., Rajski, J.: Compactor Independent Direct Diagnosis. In: Proceedings of Asian Test Symposium, pp. 15–17 (2004)
Stanojevic, Z., Guo, R., Mitra, S., Venkataraman, S.: Enabling Yield Analysis with X-compact. In: IEEE International Test Conference, pp. 734–742 (2005)
Cheng, W.-T., Sharma, M., Rinderknecht, T., Liyang, L., Hill, C.: Signature based diagnosis for logic BIST. In: IEEE International Test Conference (2007, October 21–26)
Burmer, C., Guo, R., Cheng, W.-T., Lin, X., Benware, B.: Timing Failure Debug using Debug-Friendly Scan Patterns and TRE. In: 34th International Symposium for Failure Analysis, pp. 383–389 (2008, November 2–6)
Sharma, M., Cheng, W.-T., Tai, T.-P., Cheng, Y.S., Hsu, W., Chen, L., Reddy, S.M., Mann, A.: Faster Defect Localization in Nanometer Technology Based on Defective Cell Diagnosis. In: IEEE International Test Conference (2007, October 21–26)
Fan, X., Moore, W., Hora, C., Gronthoud, G.: A Novel Stuck-at Based Method for Transistor Stuck-Open Fault Diagnosis. In: IEEE International Test Conference, pp. 253–262 (2005)
Fan, X., Moore, W., Hora, C., Konijnenburg, M., Gronthoud, G.: A Gate-Level Method for Transistor-Level Bridging Fault Diagnosis. In: Proceedings of the IEEE VLSI Test Symposium (2006)
Basturkmen, N.Z., Guo, R., Venkataraman, S.: Diagnosis of Multiple Scan Chain Failures. In: Proceedings of European Test Symposium (2008)
Lee, K.L., Basturkmen, N.Z., Venkataraman, S.: Diagnosis of Scan Clock Failures. In: Proceedings of VLSI Test Symposium, pp. 67–72 (2008)
Tang, X., Guo, R., Cheng, W.-T., Reddy, S.M., Huang, Y.: On Improving Diagnostic Test Generation for Scan Chain Failures. In: Asian Test Symposium (2009)
Wang, F., Hu, Y., Li, H., Li, X., Jing, Y., Huang, Y.: Diagnostic Pattern Generation for Compound Defects. In: ITC (2008), paper 14.1
Huang, Q., Fang, C., Mittal, S., Blanton, R.D.: Towards Smarter Diagnosis: A Learning-based Diagnostic Outcome Previewer. ACM Trans. Des. Automat. Electron. Syst. - Special Issue on Machine Learning 25(5), 1–20 (2020)
Xue, Y., Poku, O., Li, X., Blanton, R.D.: PADRE: Physically-Aware Diagnostic Resolution Enhancement. In: IEEE International Test Conference, pp. 1–10 (2013)
Xue, Y., Li, X., Blanton, R.D.: Improving diagnostic resolution of failing ICs through learning. IEEE Trans. Comput-Aided Des. Integr. Circuits Syst. 37(6), 1288–1297 (2018)
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Venkat Raman, S. (2023). Conventional Methods for Fault Diagnosis. In: Girard, P., Blanton, S., Wang, LC. (eds) Machine Learning Support for Fault Diagnosis of System-on-Chip . Springer, Cham. https://doi.org/10.1007/978-3-031-19639-3_2
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