Abstract
Surface-mount technology is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards. The purpose of this study was to analyze nozzle change in two production lines. Following a previous study, it was proposed that one type of nozzle would place resistors while another type of nozzle would place capacitors, contrary to what happened in the initial process, where the two placed both components. However, the change of nozzle was not done globally, but only applied to two specific types of capacitors that were more critical. Even so, the positive effect of this change was globally visible, both in the decreased number of component rejection and in the reduced number of component defects in the printed circuit boards. It was also possible to estimate the percentage saving and the expected growth from this new implementation. The data were validated using statistical analysis. Finally, the current cleaning periodicity of the nozzles was examined in order to verify if it was compromising their performance.
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References
E.G. Popkova, Y.V. Ragulina, A.V. Bogoviz, Industry 4.0: industrial revolution of the 21st century, 1st edn. (Springer, New York, 2019)
L. Silva, Pick-up & placement improvement. In Portuguese. Master Thesis. University of Minho (2019)
Bosch Homepage, https://www.bosch.pt/a-nossa-empresa/bosch-em-portugal/braga/. Accessed 13 May 2019
U.S.-Tech Homepage, http://www.us-tech.com/RelId/1122151/ISvars/default/MIRTEC_Europe_to_Display_the_Revolutionary_MV-9_2D_3D_AOI_Series_at_SMT_Hybrid_Packaging.htm. Accessed 05 Apr 2020
M.I.S. Electronics Inc. Homepage, http://www.miselectronics.com/PCB-AOI-Testing.html. Accessed 21 Apr 2020
J. Angel, Chip—open or wrapped. Product. Eng. London 68(1), 17–19 (2018)
Maintenance—Maintenance Terminology: EN 13306. (August 2010). EN 13306:2010. UK: British Standards Institution
M. Ben-Daya, S.O. Duffuaa, A. Raouf, J. Knezevic, D. Ait-Kadi, Handbook of maintenance management and engineering, 1st edn. (Springer, New York, 2009)
A. Monteiro, Fiabilidade de Equipamentos na Indústria Automóvel Disponibilidade e Manutibilidade. Gestão Técnica de uma Linha de Produção. In Portuguese. Master Thesis. University of Porto (2000)
Planning Analysis: Calculating Growth Rates, https://pages.uoregon.edu/rgp/PPPM613/class8a.htm. Accessed 03 May 2020
G.W. Corder, D.I. Foreman, Nonparametric statistics. a step-by-step approach, 2nd edn. (John Wiley & Sons, New York, 2014)
Acknowledgments
This work is supported by European Structural and Investment Funds in the FEDER component, through the Operational Competitiveness and Internationalization Programme (COMPETE 2020) [Project n° 39479; Funding Reference: POCI-01-0247-FEDER-39479].
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Silva, L. et al. (2022). A Systematic Analysis of an Industrial Pickup and Placement Production System. In: Knapčíková, L., Peraković, D., Behúnová, A., Periša, M. (eds) 5th EAI International Conference on Management of Manufacturing Systems. EAI/Springer Innovations in Communication and Computing. Springer, Cham. https://doi.org/10.1007/978-3-030-67241-6_38
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DOI: https://doi.org/10.1007/978-3-030-67241-6_38
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