Skip to main content

Pick-Up and Placement Improvement: An Industrial Case Study

  • Conference paper
  • First Online:
Innovations in Mechanical Engineering (icieng 2021)

Abstract

Surface mount technology, usually on the context of Pick-up and Placement, is used on printed circuit boards assembling. In this paper, some aspects and physical parameters related with the pick-up and placement process are analysed in detail throughout the entire work sequence, such as the different variants of these same components among the various suppliers under study. In this process, there are problems of rejection and quality. The aim of this work is to identify and analyse these types of components, as well as their differences and possible causes for their misplacement on the printed circuit boards. Measurements and analyses were performed in lab tests and the study focused more on the capacitors’ assembling details. Experimental tests were carried out on the production line in order to obtain conclusive results regarding the study of nozzles and placement of components. Finally, it was concluded that nozzles 907 present a good behaviour in resistors and nozzles 925 present a good behaviour in capacitors.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 189.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 249.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

Notes

  1. 1.

    Internal number that identifies the component.

References

  1. Kunz, G., Perondi, E., Machado, J.: Modeling and simulating the controller behavior of an automated people mover using IEC 61850 communication requirements. In: IEEE International Conference on Industrial Informatics (INDIN), art. no. 6034947, pp. 603–608 (2011). https://doi.org/10.1109/INDIN.2011.6034947

  2. Campos, J.C., Machado, J.: Pattern-based analysis of automated production systems. IFAC Proc. Volumes (IFAC-PapersOnline) 13(PART 1), 972–977 (2009). https://doi.org/10.3182/20090603-3-RU-2001.0425

  3. Kunz, G., Machado, J., Perondi, E., Vyatkin, V.: A Formal methodology for accomplishing IEC 61850 real-time communication requirements. IEEE Trans. Ind. Electron. 64(8), art. no. 7878522, 6582–6590 (2017). https://doi.org/10.1109/TIE.2017.2682042

  4. Gangala, C., Modi, M., Manupati, V.K., Varela, M.L.R., Machado, J., Trojanowska, J.: Cycle time reduction in deck roller assembly production unit with value stream mapping analysis. In: Rocha, Á., Correia, A.M., Adeli, H., Reis, L.P., Costanzo, S. (eds.) WorldCIST. AISC, vol. 571, pp. 509–518. Springer, Cham (2017). https://doi.org/10.1007/978-3-319-56541-5_52

    Chapter  Google Scholar 

  5. Trojanowska, J., Zywicki, K., Varela, M.L.R., Machado, J.M.: Shortening changeover time - an industrial study. In: 2015 10th Iberian Conference on Information Systems and Technologies, CISTI 2015, art. no. 7170373 (2015). https://doi.org/10.1109/CISTI.2015.7170373

  6. Vieira, G.G., Varela, M.L.R., Putnik, G.D., Machado, J.M., Trojanowska, J.: Integrated platform for real-time control and production and productivity monitoring and analysis. Rom. Rev. Precis. Mech. Opt. Mechatron. 2016(50), 119–127 (2016)

    Google Scholar 

  7. Surface-mount technology Homepage. https://en.wikipedia.org/wiki/Surface-mount_technology#/media/File:SMT_sizes,_based_on_original_by_Zureks.svg. Accessed 18 Apr 2019

  8. Kitada, T., Seki, Y.: Mounting Technique of 0402 - Sized Surface-Mount (SMD) on FPC, p. 29, Fujikura Technical Review (2011)

    Google Scholar 

  9. Bosch em Portugal Braga Homepage. https://www.bosch.pt/a-nossa-empresa/bosch-em-portugal/braga/. Accessed 03 June 2019

  10. Yilmaz, I.: Development and Evaluation of Setup Strategies in Printed Circuit Board Assembly, 1st edn. Springer, Heidelberg (2008). https://doi.org/10.1007/978-3-8349-9872-9

    Book  Google Scholar 

  11. Ayob, M., Kendall, G.: A survey of surface mount device placement machine optimisation: machine classification. Eur. J. Oper. Res. 22 (2007)

    Google Scholar 

  12. SMT_Nomenclature Homepage. https://www.topline.tv/SMT_Nomenclature.pdf. Accessed 15 Apr 2019

  13. Samsung-Electro-Mechanics-datasheet-81461623.pdf Homepage. https://datasheet.octopart.com/CL05B104KO5NNNC-Samsung-Electro-Mechanics-datasheet-81461623.pdf. Accessed 05 Apr 2019

  14. mcr-e.pdf. Homepage. https://fscdn.rohm.com/en/products/databook/datasheet/passive/resistor/chip_resistor/mcr-e.pdf. Accessed 12 Apr 2019

Download references

Acknowledgements

This work is supported by: European Structural and Investment Funds in the FEDER component, through the Operational Competitiveness and Internationalization Programme (COMPETE 2020) [Project nº 39479; Funding Reference: POCI-01-0247-FEDER-39479].

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Luís Silva .

Editor information

Editors and Affiliations

Rights and permissions

Reprints and permissions

Copyright information

© 2022 The Author(s), under exclusive license to Springer Nature Switzerland AG

About this paper

Check for updates. Verify currency and authenticity via CrossMark

Cite this paper

Silva, L., Meireles, J., Pinhão, M., Gonçalves, A.M., Malheiro, M.T. (2022). Pick-Up and Placement Improvement: An Industrial Case Study. In: Machado, J., Soares, F., Trojanowska, J., Ottaviano, E. (eds) Innovations in Mechanical Engineering. icieng 2021. Lecture Notes in Mechanical Engineering. Springer, Cham. https://doi.org/10.1007/978-3-030-79165-0_28

Download citation

  • DOI: https://doi.org/10.1007/978-3-030-79165-0_28

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-79164-3

  • Online ISBN: 978-3-030-79165-0

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics