1. MICRO SYSTEM Technologies 2001, Conference, Düsseldorf, 27th to 29th March 2001

   FOREWORD Pages: 203 - 203

2. Microsensor packaging

   • O. Brand
   • H. Baltes

   Pages: 205 - 208

3. Laser micromaching and light induced reaction injection molding as suitable process sequence for the rapid fabrication of microcomponents

   • T. Hanemann
   • W. Pfleging
   • K.-H. Zum

   Pages: 209 - 214

4. High quality laser beam soldering

   • L. Bosse
   • A. Schildecker
   • R. Poprawe

   Pages: 215 - 219

5. A new approach for the assembly of lenses in front of flexible miniature fibre-scopes

   • T. Pfeifer
   • G. Dussler
   • F. Bitte

   Pages: 220 - 224

6. Wear resistant tools for reproduction technologies produced by micro powder metallurgy

   • A. Rota
   • T.-V. Duong
   • T. Hartwig

   Pages: 225 - 228

7. Reduction of the optical loss and optimization of polycyanurate thermosets used in integrated optics

   • C. Dreyer
   • M. Bauer
   • C. Zawadzki

   Pages: 229 - 238

8. Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering

   • G. Elger
   • M. Hutter
   • E. Jäger

   Pages: 239 - 243

9. Safety relevant microsystems for automotive applications

   • H. Seidel
   • M. Aikele
   • S. Toelg

   Pages: 244 - 248

10. Multichip module with free-space optical interconnects and VCSEL-solder-joints

    • C. Gimkiewicz
    • D. Hagedorn

    Pages: 249 - 255

11. Motion from the nanoscale world

    • V. Klocke

    Pages: 256 - 260

12. A linear microactuator with enhanced design

    • J. Edler
    • H.-D. Stölting
    • H. H. Gatzen

    Pages: 261 - 264

13. Microfabrication of single-use plastic microfluidic devices for high-throughput screening and DNA analysis

    • A. Gerlach
    • G. Knebel
    • TH. Sshaller

    Pages: 265 - 268

14. Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study

    • S.-Y. Jang
    • J. Wolf
    • K.-W. Paik

    Pages: 269 - 272