Volume 19, Issue 5

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May 2013

Special section on WaferBond‘11, ‘‘International Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration’’

17 articles in this issue

Special issue on WaferBond‘11

Editorial 26 March 2013 Pages: 645 - 646
Direct bonding of titanium layers on silicon
F. Baudin
L. Di Cioccio
Y. Bréchet
Technical Paper 04 September 2012 Pages: 647 - 653
Aluminum–germanium wafer bonding of (AlGaIn)N thin-film light-emitting diodes
Christian Goßler
Michael Kunzer
Joachim Wagner
Technical Paper 11 December 2012 Pages: 655 - 659
Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration
J. Fan
D. F. Lim
C. S. Tan
Technical Paper 30 October 2012 Pages: 661 - 667
Laser transmission bonding of silicon to silicon with metallic interlayers for wafer-level packaging
Anselm Wissinger
Alexander Olowinsky
Reinhart Poprawe
Technical Paper 31 July 2012 Pages: 669 - 673
Hydrophobic direct bonding of silicon reconstructed surfaces
C. Rauer
F. Rieutord
H. Moriceau
Technical Paper 12 February 2013 Pages: 675 - 679
Room temperature bonding for vacuum applications: climatic and long time tests
S. Langa
J. Utsumi
C. Drabe
Technical Paper 30 November 2012 Pages: 681 - 687
Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy
Falk Naumann
Sebastian Brand
Matthias Petzold
Technical Paper 04 September 2012 Pages: 689 - 695
Characterization of bonded wafer stacks by use of the photoelastic-analysis-method
H. Geiler
K. Schulz
R. Knechtel
Technical Paper 06 March 2013 Pages: 697 - 703
The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers
V. Masteika
J. Kowal
T. Rogers
Technical Paper 03 November 2012 Pages: 705 - 712
Optimization of MEMS capacitive accelerometer
Mourad Benmessaoud
Mekkakia Maaza Nasreddine
Review Paper Open access 01 March 2013 Pages: 713 - 720
Thermoelastic dissipation in stepped-beam resonators
K. Tunvir
Technical Paper 04 October 2012 Pages: 721 - 731
A circular microchannel with integrated electrodes for DNA electrophoresis
B. Lerner
P. A. Kler
C. L. A. Berli
Technical Paper 10 October 2012 Pages: 733 - 742
Patterning of carbon nanotube films on PDMS using SU-8 microstructures
Dongil Kim
Kwang-Seok Yun
Technical Paper 12 October 2012 Pages: 743 - 748
An adsorption-based mercury sensor with continuous readout
Milija Sarajlić
Zoran G. Đurić
Dragana S. Đorđević
Technical Paper 14 October 2012 Pages: 749 - 755
Void-free trench isolation based on a new trench design
Xiao-Ying Li
Guang-Tao Li
Da-Yong Qiao
Technical Paper 16 October 2012 Pages: 757 - 761
A novel movable electrode for realizing deep sub-micrometer gap in SOI-based MEMS square resonator
J. W. Jiang
J. F. Bao
C. Deng
Technical Paper 21 October 2012 Pages: 763 - 772

Volume 19, Issue 5

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