Recent Advances in Machining of Silicon Wafers for Semiconductor Applications P.S. SreejithG. UdupaB.K.A. Ngoi Pages: 157 - 162
Selection of the Machining Inclination Angle in High-Speed Ball End Milling T.J. KoH.S. KimS.S. Lee Pages: 163 - 170
Robust Spiral Tool-Path Generation for Arbitrary Pockets Chung-Fong YouBor-Tyng SheenTzu-Kuan Lin Pages: 181 - 188
Application of Ball Bar System and Genetic Algorithms for CNC Lathe Contouring Compensation Wen-Yuh JyweChien-Hong Liu Pages: 189 - 195
The Application of the Skipped Layer Interior Method and Higher Depostition Height to Accelerate Fabrication Speed of the Model Maker Rapid Prototyping System J.-Y. JengJ.-C. WangT.T. Lin Pages: 204 - 209
Optimising Operating Conditions by Selection of Optimal Threshold Value for Digital-Digital Dynamic Characteristic M.-H. Caleb Li Pages: 210 - 215
Application of a Layout/Material Handling Design Method to a Furnace Area in a 300 mm Wafer Fab P.M.C. HesenP.J.J. RendersJ.E. Rooda Pages: 216 - 220
Intelligent Machine Tools in a Distributed Network Manufacturing Mode Environment Tao ChengJie ZhangShuzi Yang Pages: 221 - 232