1. Foreword

   News 07 October 2011 Pages: 1 - 1

2. Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System

   • C. E. Ho
   • L. H. Hsu
   • M. A. Rahman

   OriginalPaper 20 July 2011 Pages: 2 - 10

3. Solid–Solid Reaction Between Sn-3Ag-0.5Cu Alloy and Au/Pd(P)/Ni(P) Metallization Pad with Various Pd(P) Thicknesses

   • C. E. Ho
   • W. H. Wu
   • C. S. Lin

   OriginalPaper 13 August 2011 Pages: 11 - 21

4. Phase Equilibria of the Sn-Bi-Te Ternary System

   • Chen-nan Chiu
   • Chia-ming Hsu
   • Hsin-jay Wu

   OriginalPaper 18 August 2011 Pages: 22 - 31

5. Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System

   • M. Hashiba
   • W. Shinmei
   • M. Kajihara

   OriginalPaper 02 September 2011 Pages: 32 - 43

6. Fast Concurrent Growth of Ni₃Sn₄ and Voids During Solid-State Reaction Between Sn-Rich Solder and Ni Substrates

   • Bo-Mook Chung
   • Jaeho Choi
   • Joo-Youl Huh

   OriginalPaper 02 September 2011 Pages: 44 - 52

7. Optical Properties and Durability of Al₂O₃-NiP/Al Solar Absorbers Prepared by Electroless Nickel Composite Plating

   • T. K. Tsai
   • S. J. Hsueh
   • J. S. Fang

   OriginalPaper 22 September 2011 Pages: 53 - 59

8. A Study on Sputtered Bi-Te Thermoelectric Films with Various Compositions: Microstructure Evolution and the Effects on Thermoelectric and Electrical Properties

   • Minsub Oh
   • Seong-jae Jeon
   • Hoo-jeong Lee

   OriginalPaper 21 September 2011 Pages: 60 - 66

9. The Effect of Sb Addition on Sn-Based Alloys for High-Temperature Lead-Free Solders: an Investigation of the Ag-Sb-Sn System

   • D. Li
   • S. Delsante
   • G. Borzone

   OriginalPaper 20 October 2011 Pages: 67 - 85

10. Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System

    • Wojciech Gierlotka

    OriginalPaper 01 October 2011 Pages: 86 - 108

11. A Study on the Breakdown Mechanism of an Electroless-Plated Ni(P) Diffusion Barrier for Cu/Sn/Cu 3D Interconnect Bonding Structures

    • Byunghoon Lee
    • Haseok Jeon
    • Hoo-Jeong Lee

    OriginalPaper 14 October 2011 Pages: 109 - 114

12. A Simple Process for Synthesis of Ag Nanoparticles and Sintering of Conductive Ink for Use in Printed Electronics

    • Inyu Jung
    • Yun Hwan Jo
    • Hyuck Mo Lee

    OriginalPaper 17 September 2011 Pages: 115 - 121

13. The Transparent Conductive Properties of Manganese-Doped Zinc Oxide Films Deposited by Chemical Bath Deposition

    • J.S. Fang
    • W.H. Luo
    • T.K. Tsai

    OriginalPaper 28 September 2011 Pages: 122 - 129

14. Cross-Interaction Study of Cu/Sn/Pd and Ni/Sn/Pd Sandwich Solder Joint Structures

    • C. T. Lu
    • T.S. Huang
    • C.Y. Liu

    OriginalPaper 30 September 2011 Pages: 130 - 137

15. Low-Resistivity Ru-Ta-C Barriers for Cu Interconnects

    • J.S. Fang
    • J.H. Lin
    • T.S. Chin

    OriginalPaper 05 November 2011 Pages: 138 - 143

16. Interfacial Reactions in Sn/Fe-xNi Couples

    • Yee-Wen Yen
    • Hsien-Ming Hsiao
    • Chiapyng Lee

    OriginalPaper 12 August 2011 Pages: 144 - 152

17. Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials

    • T.Y. Lin
    • C.N. Liao
    • Albert T. Wu

    OriginalPaper 09 September 2011 Pages: 153 - 158

18. Elucidating the Metal-Induced Crystallization and Diffusion Behavior of Al/a-Ge Thin Films

    • Chao-Nan Yeh
    • Kewin Yang
    • Albert T. Wu

    OriginalPaper 01 November 2011 Pages: 159 - 165

19. Conductor Formation Through Phase Transformation in Ti-Oxide Thin Films

    • Y. S. Liu
    • Y. H. Lin
    • C. Y. Liu

    OriginalPaper 09 December 2011 Pages: 166 - 171

20. Ni Interdiffusion Coefficient and Activation Energy in Cu₆Sn₅

    • Kuan-Chih Huang
    • Fuh-Sheng Shieu
    • C. Y. Liu

    OriginalPaper 30 November 2011 Pages: 172 - 175