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Characterization and Electrochemical Mechanism for Bromide-Containing Conductive Anodic Filament (CAF) Failure Antonio CaputoLaura J. TurbiniDoug D. Perovic OriginalPaper 06 July 2011 Pages: 1884 - 1894
Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects Tae-Kyu LeeBo LiuKuo-Chuan Liu OriginalPaper 20 May 2011 Pages: 1895 - 1902
Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100−x -Sn x Solders E. ÇadirliH. KayaM. Şahin OriginalPaper 04 June 2011 Pages: 1903 - 1911
Effects of Joining Sequence on the Interfacial Reactions and Substrate Dissolution Behaviors in Ni/Solder/Cu Joints Chao Sheng LiuCheng En HoC. Robert Kao OriginalPaper 17 June 2011 Pages: 1912 - 1920
Evaluation of Electrochemical Migration on Printed Circuit Boards with Lead-Free and Tin-Lead Solder Xiaofei HeMichael H. AzarianMichael G. Pecht OriginalPaper 15 June 2011 Pages: 1921 - 1936
Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish Q. V. BuiN. D. NamS. B. Jung OriginalPaper 21 June 2011 Pages: 1937 - 1942
Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing Shang-Hua LeeChih-Ming Chen OriginalPaper 21 June 2011 Pages: 1943 - 1949
Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint Jeong-Won YoonBo-In NohSeung-Boo Jung OriginalPaper 18 June 2011 Pages: 1950 - 1955
Reaction of Liquid Sn-Ag-Cu-Ce Solders with Solid Copper J. Chriaštel’ováL. Rízeková TrnkováM. Ožvold OriginalPaper 23 June 2011 Pages: 1956 - 1961
Tin Whisker Growth on NdSn3 Powder Hong-Chang ShiAi-Ping Xian BriefCommunication 22 June 2011 Pages: 1962 - 1966
Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects Tae-Kyu LeeWeidong XieKuo-Chuan Liu OriginalPaper 29 June 2011 Pages: 1967 - 1976
Effects of Solvent Type on Low-Temperature Sintering of Silver Oxide Paste to Form Electrically Conductive Silver Film Inyoung KimSangki Chun OriginalPaper 06 July 2011 Pages: 1977 - 1983
Calculation of the Thermoelectric Power of Vanadium, Niobium, and Tantalum Horst BrodowskyQiyuan ChenZhoulan Yin OriginalPaper 15 June 2011 Pages: 1984 - 1989
Enhancement of the Stability of Ti and Ni Ohmic Contacts to 4H-SiC with a Stable Protective Coating for Harsh Environment Applications Walter DavesAndreas KraussLothar Frey OriginalPaper 21 June 2011 Pages: 1990 - 1997
Effects of Thermal Annealing on the Formation of Buried β-SiC by Ion Implantation P. R. PoudelB. RoutF. D. Mcdaniel OriginalPaper 30 June 2011 Pages: 1998 - 2003
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Photoluminescence and Raman Spectroscopy of Polycrystalline ZnO Nanofibers Deposited by Electrospinning Banani SenMichael StroscioMitra Dutta OriginalPaper 15 June 2011 Pages: 2015 - 2019
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