1. Etching of ¹⁰Boron with SF₆-based Electron Cyclotron Resonance Plasmas for Pillar-Structured Thermal Neutron Detectors

   • L. F. Voss
   • C. E. Reinhardt
   • C. L. Cheung

   OriginalPaper 20 January 2010 Pages: 263 - 267

2. Modeling of Thermal Conductivity of Graphite Nanosheet Composites

   • Wei Lin
   • Rongwei Zhang
   • C.P. Wong

   OriginalPaper 13 January 2010 Pages: 268 - 272

3. Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys

   • John W. Elmer
   • Eliot D. Specht
   • Mukul Kumar

   OriginalPaper Open access 02 February 2010 Pages: 273 - 282

4. Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints

   • Yung-Chi Lin
   • Kai-Jheng Wang
   • Jenq-Gong Duh

   OriginalPaper 11 December 2009 Pages: 283 - 294

5. A Study of Plasma-Cleaned Ag-Plated Cu Leadframe Surfaces

   • Wuhu Li

   OriginalPaper 09 December 2009 Pages: 295 - 302

6. Measurements of Microhardness and Thermal and Electrical Properties of the Binary Zn-0.7wt.%Cu Hypoperitectic Alloy

   • H. Kaya
   • U. Böyük
   • N. Maraşli

   OriginalPaper 20 January 2010 Pages: 303 - 311

7. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

   • Jir̆í Sopoušek
   • Marián Palcut
   • Jozef Janovec

   BriefCommunication 30 January 2010 Pages: 312 - 317

8. Reflow Phenomenon Analysis of Large Scale Integrated Cu Interconnections in Via Holes by Viscoelastic Deformation Simulation

   • Takashi Onishi
   • Masao Mizuno
   • Takayuki Onoda

   OriginalPaper 03 February 2010 Pages: 318 - 325

9. Effects of Solder Ball Geometry on Lap Shear Creep Rate

   • S. B. Kim
   • Jin Yu

   OriginalPaper 02 February 2010 Pages: 326 - 332

10. Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate

    • X. F. Zhang
    • J. D. Guo
    • J. K. Shang

    BriefCommunication 29 December 2009 Pages: 333 - 337

11. Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)

    • Ji Chul Yang
    • Dong Won Oh
    • Taesung Kim

    OriginalPaper 20 January 2010 Pages: 338 - 346

12. Enhanced Temperature Stability of (1 − x)(K_0.5Na_0.5)_0.94Li_0.06NbO₃-x(Bi_0.5Na_0.5)TiO₃ Lead-Free Piezoelectric Ceramics

    • J. G. Hao
    • Z. J. Xu
    • Q. R. Yin

    OriginalPaper 29 December 2009 Pages: 347 - 354