Volume 39, Issue 3 | Journal of Electronic Materials

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Volume 39, Issue 3

March 2010

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12 articles in this issue

Etching of ¹⁰Boron with SF₆-based Electron Cyclotron Resonance Plasmas for Pillar-Structured Thermal Neutron Detectors
L. F. Voss
C. E. Reinhardt
C. L. Cheung
OriginalPaper 20 January 2010 Pages: 263 - 267
Modeling of Thermal Conductivity of Graphite Nanosheet Composites
Wei Lin
Rongwei Zhang
C.P. Wong
OriginalPaper 13 January 2010 Pages: 268 - 272
Microstructure and In Situ Observations of Undercooling for Nucleation of β-Sn Relevant to Lead-Free Solder Alloys
John W. Elmer
Eliot D. Specht
Mukul Kumar
OriginalPaper Open access 02 February 2010 Pages: 273 - 282
Detailed Phase Evolution of a Phosphorous-Rich Layer and Formation of the Ni-Sn-P Compound in Sn-Ag-Cu/Electroplated Ni-P Solder Joints
Yung-Chi Lin
Kai-Jheng Wang
Jenq-Gong Duh
OriginalPaper 11 December 2009 Pages: 283 - 294
A Study of Plasma-Cleaned Ag-Plated Cu Leadframe Surfaces
Wuhu Li
OriginalPaper 09 December 2009 Pages: 295 - 302
Measurements of Microhardness and Thermal and Electrical Properties of the Binary Zn-0.7wt.%Cu Hypoperitectic Alloy
H. Kaya
U. Böyük
N. Maraşli
OriginalPaper 20 January 2010 Pages: 303 - 311
Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy
Jir̆í Sopoušek
Marián Palcut
Jozef Janovec
BriefCommunication 30 January 2010 Pages: 312 - 317
Reflow Phenomenon Analysis of Large Scale Integrated Cu Interconnections in Via Holes by Viscoelastic Deformation Simulation
Takashi Onishi
Masao Mizuno
Takayuki Onoda
OriginalPaper 03 February 2010 Pages: 318 - 325
Effects of Solder Ball Geometry on Lap Shear Creep Rate
S. B. Kim
Jin Yu
OriginalPaper 02 February 2010 Pages: 326 - 332
Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate
X. F. Zhang
J. D. Guo
J. K. Shang
BriefCommunication 29 December 2009 Pages: 333 - 337
Investigation on Surface Hardening of Polyurethane Pads During Chemical Mechanical Polishing (CMP)
Ji Chul Yang
Dong Won Oh
Taesung Kim
OriginalPaper 20 January 2010 Pages: 338 - 346
Enhanced Temperature Stability of (1 − x)(K_0.5Na_0.5)_0.94Li_0.06NbO₃-x(Bi_0.5Na_0.5)TiO₃ Lead-Free Piezoelectric Ceramics
J. G. Hao
Z. J. Xu
Q. R. Yin
OriginalPaper 29 December 2009 Pages: 347 - 354