Modeling of Magnetic-Field-Assisted Assembly of Semiconductor Devices Rene D. RiveroSudhakar ShetNuggehalli M. Ravindra OriginalPaper 07 December 2007 Pages: 374 - 378
Morphology of Thick SiC Epitaxial Films Grown by the Physical Vapor Transport Method B.P. WagnerN.B. SinghJ. Golombeck OriginalPaper 10 January 2008 Pages: 379 - 383
Microwave Performance of AlGaN/GaN High-Electron-Mobility Transistors on Si/SiO2/Poly-SiC Substrates T.J. AndersonF. RenJ. Thuret OriginalPaper 26 October 2007 Pages: 384 - 387
Luminescence of Long-Term Ordered Pure and Doped Gallium Phosphide Sergei PyshkinJohn BallatoGiorgio Turri OriginalPaper 23 January 2008 Pages: 388 - 395
Relationship of Band-Edge Luminescence to Recombination Lifetime in Silicon Wafers R.K. AhrenkielS.W. JohnstonP. Dippo OriginalPaper 14 November 2007 Pages: 396 - 402
Platinum and Rhodium Silicide–Germanide Optoelectronics M.P. LepselterA.T. FioryN.M. Ravindra OriginalPaper 11 September 2007 Pages: 403 - 416
Study of Fracture Mechanics in Testing Interfacial Fracture of Solder Joints W.H. BangM.-W. MoonK.H. Oh OriginalPaper 13 February 2008 Pages: 417 - 428
Analysis of Barrier Defects in Low-k/Cu Interconnects Based on Electrochemical Response and Simulation Cell Dong Mei MengNancy L. MichaelChoong-Un Kim OriginalPaper 30 October 2007 Pages: 429 - 438
Practical Surface Treatments and Surface Chemistry of n-Type and p-Type GaN J.J. UhlrichL.C. GrabowT.F. Kuech OriginalPaper 27 November 2007 Pages: 439 - 447
Antioxidant-Based Phase-Change Thermal Interface Materials with High Thermal Stability Yasuhiro AoyagiD.D.L. Chung OriginalPaper 25 January 2008 Pages: 448 - 461
Temperature Dependence of Electrical and Thermal Conductivities of an Epoxy-Based Isotropic Conductive Adhesive Masahiro InoueHiroaki MutaKatsuaki Suganuma OriginalPaper 23 January 2008 Pages: 462 - 468
Joule Heating Enhanced Phase Coarsening in Sn37Pb and Sn3.5Ag0.5Cu Solder Joints during Current Stressing B.Y. WuM.O. AlamH.W. ZHONG OriginalPaper 24 January 2008 Pages: 469 - 476
Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations Rong AnChunqing WangHuaping Wu OriginalPaper 10 January 2008 Pages: 477 - 482
Effect of Oxidation on Indium Solderability Jongman KimHarry SchoellerSeungbae Park OriginalPaper 29 December 2007 Pages: 483 - 489
Equi-Axed Grain Formation in Electrodeposited Sn-Bi E. SandnesM.E. WilliamsG.R. Stafford OriginalPaper 29 December 2007 Pages: 490 - 497
Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys Shih-Kang LinChing-Feng YangSinn-Wen Chen OriginalPaper 01 February 2008 Pages: 498 - 506
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles Yaowu ShiJianping LiuXiaoyan Li OriginalPaper 26 October 2007 Pages: 507 - 514
Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder S.M.L. NaiJ. WeiM. Gupta OriginalPaper 01 February 2008 Pages: 515 - 522
Direct Fabrication of Fine Gold Patterns from an Aqueous Solution by a UV Laser Abbu Udaiyar Senthil KumaranMasaya Ichimura OriginalPaper 05 January 2008 Pages: 523 - 526
Origin of Surface Defects in PCB Final Finishes by the Electroless Nickel Immersion Gold Process Bae-Kyun KimSeong-Jae LeeJong-Soo Yoo OriginalPaper 04 January 2008 Pages: 527 - 534
Characterization of Ge22Sb22Te56 and Sb-Excess Ge15Sb47Te38 Chalcogenide Thin Films for Phase-Change Memory Applications Sang-Ouk Ryu OriginalPaper 02 February 2008 Pages: 535 - 539
Memory Switching Characteristics in Amorphous Ga2Se3 Films A.E. Bekheet OriginalPaper 05 February 2008 Pages: 540 - 544
