1. Foreword

   • Fu Guo
   • K.N. Subramanian
   • Jin Yu

   OriginalPaper 02 October 2007 Pages: 1 - 1

2. Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging

   • Hu Hao
   • Yaowu Shi
   • Fu Guo

   OriginalPaper 12 September 2007 Pages: 2 - 8

3. Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications

   • Jong-Woong Kim
   • Young-Chul Lee
   • Seung-Boo Jung

   OriginalPaper 11 September 2007 Pages: 9 - 16

4. Tin Whisker Growth Induced by High Electron Current Density

   • Y. W. Lin
   • Yi-Shao Lai
   • C. R. Kao

   OriginalPaper 11 September 2007 Pages: 17 - 22

5. Modeling Material Properties of Lead-Free Solder Alloys

   • Zhanli Guo
   • Nigel Saunders
   • Jean-Philippe Schillé

   OriginalPaper 11 September 2007 Pages: 23 - 31

6. The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi

   • Tina Ventura
   • Christopher M. Gourlay
   • Arne K. Dahle

   OriginalPaper 19 September 2007 Pages: 32 - 39

7. Interfacial Reactions in the Sn-Bi/Te Couples

   • Chen-nan Chiu
   • Chao-hong Wang
   • Sinn-wen Chen

   OriginalPaper 21 September 2007 Pages: 40 - 44

8. Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates

   • Feng Gao
   • Hiroshi Nishikawa
   • Tadashi Takemoto

   OriginalPaper 21 September 2007 Pages: 45 - 50

9. The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys

   • C.M. Gourlay
   • J. Read
   • A.K. Dahle

   OriginalPaper 21 September 2007 Pages: 51 - 60

10. Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging

    • K.K. Hong
    • J.B. Ryu
    • J.Y. Huh

    OriginalPaper 19 September 2007 Pages: 61 - 72

11. Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders

    • Yee-Wen Yen
    • Weng-Ting Chou
    • Chun-Lei Hsu

    OriginalPaper 22 September 2007 Pages: 73 - 83

12. Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates

    • Han-Byul Kang
    • Jee-Hwan Bae
    • Cheol-Woong Yang

    OriginalPaper 22 September 2007 Pages: 84 - 89

13. Can Whiskers Grow on Bulk Lead-Free Solder?

    • John A. Nychka
    • Yan Li
    • Rong Chen

    OriginalPaper 21 September 2007 Pages: 90 - 95

14. Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration

    • Y.L. Lin
    • Y.S. Lai
    • C.R. Kao

    OriginalPaper 26 September 2007 Pages: 96 - 101

15. Mechanical Size Effects in Miniaturized Lead-Free Solder Joints

    • Peter Zimprich
    • Usman Saeed
    • Herbert Ipser

    OriginalPaper Open access 23 October 2007 Pages: 102 - 109

16. Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging

    • Yun-Hwan Jo
    • Joo Won Lee
    • Dong Chun Lee

    OriginalPaper 14 November 2007 Pages: 110 - 117

17. Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows

    • Ja-Myeong Koo
    • Bui Quoc Vu
    • Seung-Boo Jung

    OriginalPaper 10 October 2007 Pages: 118 - 124

18. Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature

    • Dong-Xia Xu
    • Yong-Ping Lei
    • Yao-Wu Shi

    OriginalPaper 20 October 2007 Pages: 125 - 133