Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging Hu HaoYaowu ShiFu Guo OriginalPaper 12 September 2007 Pages: 2 - 8
Reliability of Conductive Adhesives as a Pb-free Alternative in Flip-Chip Applications Jong-Woong KimYoung-Chul LeeSeung-Boo Jung OriginalPaper 11 September 2007 Pages: 9 - 16
Tin Whisker Growth Induced by High Electron Current Density Y. W. LinYi-Shao LaiC. R. Kao OriginalPaper 11 September 2007 Pages: 17 - 22
Modeling Material Properties of Lead-Free Solder Alloys Zhanli GuoNigel Saunders Jean-Philippe Schillé OriginalPaper 11 September 2007 Pages: 23 - 31
The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi Tina VenturaChristopher M. GourlayArne K. Dahle OriginalPaper 19 September 2007 Pages: 32 - 39
Interfacial Reactions in the Sn-Bi/Te Couples Chen-nan ChiuChao-hong WangSinn-wen Chen OriginalPaper 21 September 2007 Pages: 40 - 44
Additive Effect of Kirkendall Void Formation in Sn-3.5Ag Solder Joints on Common Substrates Feng GaoHiroshi NishikawaTadashi Takemoto OriginalPaper 21 September 2007 Pages: 45 - 50
The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys C.M. GourlayJ. ReadA.K. Dahle OriginalPaper 21 September 2007 Pages: 51 - 60
Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging K.K. HongJ.B. RyuJ.Y. Huh OriginalPaper 19 September 2007 Pages: 61 - 72
Investigation of Dissolution Behavior of Metallic Substrates and Intermetallic Compound in Molten Lead-free Solders Yee-Wen YenWeng-Ting ChouChun-Lei Hsu OriginalPaper 22 September 2007 Pages: 73 - 83
Characterization of Interfacial Reaction Layers Formed Between Sn-3.5Ag Solder and Electroless Ni-Immersion Au-Plated Cu Substrates Han-Byul KangJee-Hwan BaeCheol-Woong Yang OriginalPaper 22 September 2007 Pages: 84 - 89
Can Whiskers Grow on Bulk Lead-Free Solder? John A. NychkaYan LiRong Chen OriginalPaper 21 September 2007 Pages: 90 - 95
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration Y.L. LinY.S. LaiC.R. Kao OriginalPaper 26 September 2007 Pages: 96 - 101
Mechanical Size Effects in Miniaturized Lead-Free Solder Joints Peter ZimprichUsman SaeedHerbert Ipser OriginalPaper Open access 23 October 2007 Pages: 102 - 109
Demonstration and Characterization of Sn-3.0Ag-0.5Cu/ Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging Yun-Hwan JoJoo Won LeeDong Chun Lee OriginalPaper 14 November 2007 Pages: 110 - 117
Mechanical and Electrical Properties of Cu/Sn-3.5Ag/Cu Ball Grid Array (BGA) Solder Joints after Multiple Reflows Ja-Myeong KooBui Quoc VuSeung-Boo Jung OriginalPaper 10 October 2007 Pages: 118 - 124
Experimental Wettability Study of Lead-Free Solder on Cu Substrates Using Varying Flux and Temperature Dong-Xia XuYong-Ping LeiYao-Wu Shi OriginalPaper 20 October 2007 Pages: 125 - 133
