Improved Uniformity and Electrical Performance of Continuous-Wave Laser-Crystallized TFTs Using Metal-Induced Laterally Crystallized Si Film Chih-Pang ChangYewChung Sermon Wu OriginalPaper Open access 10 September 2008 Pages: 1653 - 1656
Growth and Structural Characterization of Spherical Silicon Crystals Grown from Polysilicon Majid GharghiSiva Sivoththaman OriginalPaper 10 September 2008 Pages: 1657 - 1664
Complex Refractive Indices of Cd x Zn1−x O Thin Films Grown by Molecular Beam Epitaxy J.W. MaresM. FalangaW.V. Schoenfeld OriginalPaper 19 August 2008 Pages: 1665 - 1673
Simultaneous Formation of Ni/Al Ohmic Contacts to Both n- and p-Type 4H-SiC Kazuhiro ItoToshitake OnishiMasanori Murakami OriginalPaper 08 August 2008 Pages: 1674 - 1680
Incomplete Energy Transfer in PVK:OPA3008:MEH-PPV Blends Su-Hua YangPo-Shou ChuangWen-Kai Chang OriginalPaper 10 September 2008 Pages: 1681 - 1685
Absorption Properties of Hybrid SnO2 Nanocrystal-Carbon Nanotube Structures Ganhua LuMing LiuJunhong Chen BriefCommunication 06 August 2008 Pages: 1686 - 1690
A Paradigm of Carbon Nanotube Interconnects in Microelectronic Packaging Yangyang SunLingbo ZhuC.P. Wong OriginalPaper 22 August 2008 Pages: 1691 - 1697
Nanoclay Paste as a Thermal Interface Material for Smooth Surfaces Chuangang LinD.D.L. Chung OriginalPaper 21 August 2008 Pages: 1698 - 1709
Kinetics of Diffusion-Induced Recrystallization in the Cu(Ni) System at Low Temperatures Y. YamamotoM. Kajihara OriginalPaper 20 August 2008 Pages: 1710 - 1720
Electromigration in Line-Type Cu/Sn-Bi/Cu Solder Joints X. GuY.C. Chan OriginalPaper 22 August 2008 Pages: 1721 - 1726
Phase Equilibria of the Sn-V System and Interfacial Reactions in Sn/V Couples Chih-Chi ChenWojcieh GierlotkaSinn-Wen Chen OriginalPaper 21 August 2008 Pages: 1727 - 1733
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish T.H. ChuangC.C. JainH.M. Wu OriginalPaper 21 August 2008 Pages: 1734 - 1741
Gold Stud Bumps Flip-Chip Bonded onto Copper Electrodes with Titanium and Silver Layers Cheng-Li ChuangJong-Ning AohGuo-Shing Huang OriginalPaper 08 August 2008 Pages: 1742 - 1750
In Situ Scanning Electron Microscopy Observation of Tensile Deformation in Sn-Ag-Cu Alloys Containing Rare-Earth Elements Wei Min XiaoYao Wu ShiFu Guo OriginalPaper 20 August 2008 Pages: 1751 - 1755
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test Ning ZhangYaowu ShiXiaoyan Li Erratum 10 September 2008 Pages: 1756 - 1756