1. Pure germanium epitaxial growth on thin strained silicon-germanium graded layers on bulk silicon substrate for high-mobility channel metal-oxide-semiconductor field-effect transistors

   • S. Dey
   • S. Joshi
   • S. K. Banerjee

   OriginalPaper Pages: 1607 - 1612

2. Analysis of leakage currents in MOCVD grown GaInAsSb based photodetectors operating at 2 µm

   • Vinay Bhagwat
   • Yegao Xiao
   • Vikram Kumar

   OriginalPaper Pages: 1613 - 1617

3. Nanoparticle ordering by dewetting of Co on SiO₂

   • C. Favazza
   • J. Trice
   • Ramki Kalyanaraman

   OriginalPaper Pages: 1618 - 1620

4. Abnormal growth of tin whiskers in a Sn3Ag0.5Cu0.5Ce solder ball grid array package

   • Tung-Han Chuang
   • Shiu-Fang Yen

   OriginalPaper Pages: 1621 - 1627

5. Comparative evaluation of thermal interface materials for improving the thermal contact between an operating computer microprocessor and its heat sink

   • Timothy A. Howe
   • Chia-Ken Leong
   • D. D. L. Chung

   OriginalPaper Pages: 1628 - 1635

6. Epitaxial growth of CdTe on (211) silicon mesas formed by deep reactive ion etching

   • Jay Molstad
   • Phil Boyd
   • J. H. Dinan

   OriginalPaper Pages: 1636 - 1640

7. Effect of electrode material on transport and chemical sensing characteristics of metal/carbon nanotube contacts

   • F. E. Jones
   • A. A. Talin
   • W. M. Clift

   OriginalPaper Pages: 1641 - 1646

8. Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results

   • S. W. Liang
   • Y. W. Chang
   • S. H. Lin

   OriginalPaper Pages: 1647 - 1654

9. Study of electromigration in eutectic SnPb solder stripes using the edge displacement method

   • C. K. Chou
   • Y. C. Hsu
   • Chih Chen

   OriginalPaper Pages: 1655 - 1659

10. Growth of intermetallic compounds in the Sn-9Zn/Cu joint

    • C. S. Lee
    • F. S. Shieu

    OriginalPaper Pages: 1660 - 1664

11. Optimal phosphorous content selection for the soldering reaction of Ni-P under bump metallization with Sn-Ag-Cu solder

    • Yung-Chi Lin
    • Jenq-Gong Duh

    OriginalPaper Pages: 1665 - 1671

12. Strengthening effects of ZrO₂ nanoparticles on the microstructure and microhardness of Sn-3.5Ag lead-free solder

    • J. Shen
    • Y. C. Liu
    • H. X. Gao

    OriginalPaper Pages: 1672 - 1679

13. Structural and optical properties of Zn_1−xMg_xO thin films synthesized with metal organic chemical vapor deposition

    • S. -H. Park
    • K. -B. Kim
    • S. -W. Han

    OriginalPaper Pages: 1680 - 1684

14. Novel abrasive-free planarization of 4H-SiC (0001) using catalyst

    • Hideyuki Hara
    • Yasuhisa Sano
    • Kazuto Yamauch

    OriginalPaper Pages: L11 - L14