1. Study of intermetallic crystal growth between Nb and molten 52In-48Sn solder

   • Samjid H. Mannan
   • Mike P. Clode
   • Mohamed Dagher

   Regular Issue Paper Pages: 125 - 131

2. Surface modification of silicon by laser surface treatment: Improvement of adhesion and copper deposition

   • Cheon Lee
   • Dong-Yong Kim
   • Chang-Su Hui

   Regular Issue Paper Pages: 132 - 136

3. Microstructural development of Sn-Ag-Cu solder joints

   • Andreas R. Fix
   • Gabriel A. López
   • Eric J. Mittemeijer

   Regular Issue Paper Pages: 137 - 142

4. Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

   • M. N. Islam
   • Ahmed Sharif
   • Y. C. Chan

   Regular Issue Paper Pages: 143 - 149

5. Spray deposition and characterization of zirconium-oxide thin films

   • A. Ortiz
   • J. C. Alonso
   • E. Haro-Poniatowski

   Regular Issue Paper Pages: 150 - 155

6. Growth and optimization of extremely high-pulse-power graded-index separate confinement heterostructure quantum well AlGaAs/InGaAs diode lasers with broadened waveguides

   • J. Z. Li
   • R. U. Martinelli
   • J. H. Abeles

   Regular Issue Paper Pages: 156 - 160

7. Influence of interfacial reaction layer on reliability of chip-scale package joint from using Sn-37Pb and Sn-8Zn-3Bi solder

   • Chung-Hee Yu
   • Kyung-Seob Kim
   • Hyo-Joeng Jeon

   Regular Issue Paper Pages: 161 - 167

8. Thermal behavior of silver nanoparticles for low-temperature interconnect applications

   • Kyoung-Sik Moon
   • Hai Dong
   • C. P. Wong

   Regular Issue Paper Pages: 168 - 175

9. Nitrogen-doped Ge₂Sb₂Te₅ films for nonvolatile memory

   • Yunfeng Lai
   • Baowei Qiao
   • Bomy Chen

   Regular Issue Paper Pages: 176 - 181

10. Controlling the microstructure from the gold-tin reaction

    • J. Y. Tsai
    • C. W. Chang
    • C. R. Kao

    Regular Issue Paper Pages: 182 - 187

11. Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints

    • S. W. Shin
    • Jin Yu

    Regular Issue Paper Pages: 188 - 195

12. Tensile creep and microstructural characterization of bulk Sn3.9Ag0.6Cu lead-free solder

    • Qiang Xiao
    • William D. Armstrong

    Regular Issue Paper Pages: 196 - 211

13. Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy

    • Tarek El-Ashram
    • R. M. Shalaby

    Regular Issue Paper Pages: 212 - 215