Study of intermetallic crystal growth between Nb and molten 52In-48Sn solder Samjid H. MannanMike P. ClodeMohamed Dagher Regular Issue Paper Pages: 125 - 131
Surface modification of silicon by laser surface treatment: Improvement of adhesion and copper deposition Cheon LeeDong-Yong KimChang-Su Hui Regular Issue Paper Pages: 132 - 136
Microstructural development of Sn-Ag-Cu solder joints Andreas R. FixGabriel A. LópezEric J. Mittemeijer Regular Issue Paper Pages: 137 - 142
Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging M. N. IslamAhmed SharifY. C. Chan Regular Issue Paper Pages: 143 - 149
Spray deposition and characterization of zirconium-oxide thin films A. OrtizJ. C. AlonsoE. Haro-Poniatowski Regular Issue Paper Pages: 150 - 155
Growth and optimization of extremely high-pulse-power graded-index separate confinement heterostructure quantum well AlGaAs/InGaAs diode lasers with broadened waveguides J. Z. LiR. U. MartinelliJ. H. Abeles Regular Issue Paper Pages: 156 - 160
Influence of interfacial reaction layer on reliability of chip-scale package joint from using Sn-37Pb and Sn-8Zn-3Bi solder Chung-Hee YuKyung-Seob KimHyo-Joeng Jeon Regular Issue Paper Pages: 161 - 167
Thermal behavior of silver nanoparticles for low-temperature interconnect applications Kyoung-Sik MoonHai DongC. P. Wong Regular Issue Paper Pages: 168 - 175
Nitrogen-doped Ge2Sb2Te5 films for nonvolatile memory Yunfeng LaiBaowei QiaoBomy Chen Regular Issue Paper Pages: 176 - 181
Controlling the microstructure from the gold-tin reaction J. Y. TsaiC. W. ChangC. R. Kao Regular Issue Paper Pages: 182 - 187
Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints S. W. ShinJin Yu Regular Issue Paper Pages: 188 - 195
Tensile creep and microstructural characterization of bulk Sn3.9Ag0.6Cu lead-free solder Qiang XiaoWilliam D. Armstrong Regular Issue Paper Pages: 196 - 211
Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy Tarek El-AshramR. M. Shalaby Regular Issue Paper Pages: 212 - 215
