A constitutive model for creep of lead-free solders undergoing strain-enhanced microstructural coarsening: A first report I. Dutta Regular Issue Paper Pages: 201 - 207
Electrical, optical, and thermodynamical aspects of sound propagation in HgTe, HgSe, Hg1−xMnxSe, and MnZn spinel ferrites M. SrećkovićN. IvanovićS. Bojanić Regular Issue Paper Pages: 208 - 214
Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying H. L. LaiJ. G. Duh Regular Issue Paper Pages: 215 - 220
Effect of temperature on elastic properties of woven-glass epoxy composites for printed circuit board applications Parsaoran HutapeaJoachim L. Grenestedt Regular Issue Paper Pages: 221 - 227
Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications J. H. ZhangY. C. Chan Regular Issue Paper Pages: 228 - 234
Properties of lead-free solder SnAgCu containing minute amounts of rare earth Zhigang ChenYaowu ShiYanfu Yan Regular Issue Paper Pages: 235 - 243
Optical properties of InAs1−xNx/In0.53Ga0.47As single quantum wells grown by gas source molecular beam epitaxy Guan-Ru ChenHao-Hsiung LinDing-Kang Shih Regular Issue Paper Pages: 244 - 248
Low-resistance polysilicon process in contact application for high density devices Woo-Seok Cheong Regular Issue Paper Pages: 249 - 253
Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-Plated kovar Edwin P. LopezPaul T. ViancoJerome A. Rejent Regular Issue Paper Pages: 254 - 260
The effect of strain on abnormal grain growth in Cu thin films M. MoriyamaK. MatsunagaMasanori Murakami Regular Issue Paper Pages: 261 - 267
Optical response of tin nitride thin films prepared by halide chemical vapor deposition under atmospheric pressure N. TakahashiK. TeradaY. Kawata Regular Issue Paper Pages: 268 - 271
New copper seed-layer enhancement process metrology for advanced dual-damascene interconnects Shih-Wei LeeFrank G. ShiSergey D. Lopatin Regular Issue Paper Pages: 272 - 277
Damage produced in model solder (Sn-37Pb) joints during thermomechanical cycling X. W. LiuW. J. Plumbridge Regular Issue Paper Pages: 278 - 286
