1. Electroluminescence and lasing properties of highly Bi-doped PbTe epitaxial layers grown by temperature difference method under controlled vapor pressure

   • Wataru Tamura
   • Arata Yasuda
   • Jun-Ichi Nishizawa

   Regular Issue Paper Pages: 39 - 42

2. Palladium as a contact material for InSb semiconductors—The In-Pd-Sb phase diagram

   • Christoph Luef
   • Hans Flandorfer
   • Herbert Ipser

   Regular Issue Paper Pages: 43 - 51

3. Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating

   • Chi-Won Hwang
   • Jung-Goo Lee
   • Hirotaro Mori

   Regular Issue Paper Pages: 52 - 62

4. The wettability and microstructure of Sn-Zn-RE alloys

   • C. M. L. Wu
   • C. M. T. Law
   • L. Wang

   Regular Issue Paper Pages: 63 - 69

5. Phase formation and diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems

   • Thomas Studnitzky
   • Rainer Schmid-Fetzer

   Regular Issue Paper Pages: 70 - 80

6. Thermodynamic modeling of the Au-In-Sb ternary system

   • H. S. Liu
   • C. L. Liu
   • K. Ishida

   Regular Issue Paper Pages: 81 - 88

7. Effects of Ni thickness and reflow times on interfacial reactions between Ni/Cu under-bump metallization and eutectic Sn-Pb solder in flip-chip technology

   • Chien-Sheng Huang
   • Jenq-Gong Duh
   • Jyh-Hwa Wang

   Regular Issue Paper Pages: 89 - 94

8. Wetting interaction between Sn-Zn-Ag solders and Cu

   • Kwang-Lung Lin
   • Chia-Ling Shih

   Regular Issue Paper Pages: 95 - 100

9. Current-carrying capacity of anisotropic-conductive film joints for the flip chip on flex applications

   • S. H. Fan
   • Y. C. Chan

   Regular Issue Paper Pages: 101 - 108