Low-resistance and thermally stable Pd/Ru ohmic contacts to p-type GaN Ja-Soon JangChang-Won LeeI. T. Ferguson Regular Issue Paper Pages: 903 - 906
Phase equilibria and solidification properties of Sn-Cu-Ni alloys Chih-Hao LinSinn-Wen ChenChao-Hong Wang Regular Issue Paper Pages: 907 - 915
Electrical characterization of isotropic conductive adhesive under mechanical loading Zhimin MoXitao WangJohan Liu Regular Issue Paper Pages: 916 - 920
The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements C. M. L. WuD. Q. YuL. Wang Regular Issue Paper Pages: 921 - 927
Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys C. M. L. WuD. Q. YuL. Wang Regular Issue Paper Pages: 928 - 932
Effect of heating on the electrical resistivity of conductive adhesive and soldered joints Kyu Dong KimD. D. L. Chung Regular Issue Paper Pages: 933 - 939
The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu Shou Chang ChengKwang Lung Lin Regular Issue Paper Pages: 940 - 945
Residual-mechanical behavior of thermomechanically fatigued Sn-Ag based solder joints J. G. LeeF. GuoJ. P. Lucas Regular Issue Paper Pages: 946 - 952
Evaluation of the mechanical properties of a ternary Sn-20In-2.8Ag solder M. S. Yeh Regular Issue Paper Pages: 953 - 956
Electrical properties of carbon nitride thin films: Role of morphology and hydrogen content E. BroitmanN. HellgrenL. Hultman Letter Pages: L11 - L15
