1. Foreword

   EditorialNotes Pages: 691 - 691

2. Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review

   • Judith Glazer

   ReviewPaper Pages: 693 - 700

3. Lead (Pb)-free solders for electronic packaging

   • Sung K. Kang
   • Amit K. Sarkhel

   OriginalPaper Pages: 701 - 707

4. In search of new lead-free electronic solders

   • E. P. Wood
   • K. L. Nimmo

   OriginalPaper Pages: 709 - 713

5. Improved mechanical properties in new, Pb-free solder alloys

   • M. Mccormack
   • S. Jin

   OriginalPaper Pages: 715 - 720

6. Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis

   • P. T. Vianco
   • K. L. Erickson
   • P. L. Hopkins

   OriginalPaper Pages: 721 - 727

7. Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part II: Modeling

   • K. L. Erickson
   • P. L. Hopkins
   • P.T Vianco

   OriginalPaper Pages: 729 - 734

8. Dispersoid additions to a Pb-free solder for suppression of microstructural coarsening

   • S. Jin
   • M. McCormack

   OriginalPaper Pages: 735 - 739

9. Investigation of multi-component lead-free solders

   • M. E. Loomans
   • S. Vaynman
   • M. E. Fine

   OriginalPaper Pages: 741 - 746

10. A thermodynamic study of the phase equilibria in the Bi-Sn-Sb system

    • H. Ohtani
    • K. Ishida

    OriginalPaper Pages: 747 - 755

11. Evaluation of Lead- Free Solder Joints in Electronic Assemblies

    • I. Artaki
    • A. M. Jackson
    • P. T. Vianco

    OriginalPaper Pages: 757 - 764

12. Microstructure evolution of eutectic Sn-Ag solder joints

    • Wenge Yang
    • Robert W. Messler
    • Lawrence E. Felton

    OriginalPaper Pages: 765 - 772

13. Role of tin content in the wetting of cu and au by tin-bismuth solders

    • Tamar A. Powers
    • T. J. Singler
    • J. A. Clum

    OriginalPaper Pages: 773 - 778

14. The influence of temperature and humidity on printed wiring board surface finishes: Immersion tin vs organic azoles

    • U. Ray
    • I. Artaki
    • P. T. Vianco

    OriginalPaper Pages: 779 - 785

15. Intermetallic phase formation in thin solid-liquid diffusion couples

    • F. Bartels
    • J. W. Morris
    • W. Gust

    OriginalPaper Pages: 787 - 790

16. A comparison of TMGa and TEGa for low-temperature metalorganic chemical vapor deposition growth of CCI₄-doped inGaAs

    • S. A. Stockman
    • A. W. Hanson
    • G. E. Stillman

    OriginalPaper Pages: 791 - 799

17. An accurate and computationally efficient semi-empirical model for arsenic implants into single-crystal (100) silicon

    • Shyh-Horng Yang
    • Steven J. Morris
    • Gayle Lux

    OriginalPaper Pages: 801 - 808

18. Comparison of Mg and Zn gate implants for GaAs n-channel junction field effect transistors

    • M. E. Sherwin
    • J. C. Zolper
    • J. F. Klem

    OriginalPaper Pages: 809 - 818

19. Feasibility of BCB as an interlevel dielectric in integrated circuits

    • S. Bothra
    • M. Kellam
    • P. Garrou

    OriginalPaper Pages: 819 - 825

20. Patterning and etching of amorphous teflon films

    • C. -C. Cho
    • R. M. Wallace
    • L. A. Files-Sesler

    OriginalPaper Pages: 827 - 830

21. Low-Temperature photoluminescence of SiGe/Si disordered multiple quantum wells and quantum well wires

    • J. Lee
    • S. H. Li
    • P. K. Bhattacharya

    OriginalPaper Pages: 831 - 833

22. Chemical etching of ZnSe crystals

    • Hitoshi Tamura
    • Yasuo Okuno
    • Hiroyuki Kato

    OriginalPaper Pages: 835 - 838