Deposition and characterization of Pb TiO3 thin films on silicon wafers using metalorganic sources Cheol Seong HwangHyeong Joon Kim Regular Issue Paper Pages: 707 - 716
Characterization of TiN/TiSi2 bilayer for application to ULSI Cheol-Jin LeeYung-Kwon Sung Regular Issue Paper Pages: 717 - 723
Defects in III–V materials and the accommodation of strain in layered semiconductors Bruce SteinerJames ComasKrishna Rajan Regular Issue Paper Pages: 725 - 738
Phonon-resolved and broad photoluminescence in strained Si1−xGex alloy MBE layers J. -P. NoëlN. L. RowellD. D. Perovic Regular Issue Paper Pages: 739 - 743
Improved efficiency in polymer light-emitting diodes using air-stable electrodes S. ArataniC. ZhangA. J. Heeger Regular Issue Paper Pages: 745 - 749
Convection heat transfer from a hybrid circuit F. SarvarP. A. WittingN. J. Poole Regular Issue Paper Pages: 751 - 754
Development of high-quantum-efficiency, lattice-mismatched, 1.0-eV GaInAs solar cells J. C. SchultzM. E. Klausmeier-BrownK. M. Jones Regular Issue Paper Pages: 755 - 761
Fabrication of ultrathin SOI by SIMOX water bonding (SWB) Q. -Y. TongU. Gösele Regular Issue Paper Pages: 763 - 768
The formation and growth of intermetallics in composite solder Yujing WuJennifer A. SeesRussell F. Pinizzotto Regular Issue Paper Pages: 769 - 777
Micro-raman characterization of molecular-beam epitaxial ge heterolayers on Si substrates M. IchimuraY. MoriguchiA. Sasaki Regular Issue Paper Pages: 779 - 784
Effect of rapid thermally nitrided titanium films contacting silicided and nonsilicided junctions S. ChittipeddiC. M. DziubaB. Rambabu Regular Issue Paper Pages: 785 - 791
Molecular beam epitaxial growth of Si1−xGex/Si pseudomorphic layers using disilane and germanium S. H. LiP. K. BhattacharyaE. Gulari Letter Pages: 793 - 795
Out-of-plane thermal expansion coefficient of biphenyldianhydride-phenylenediamine polyimide film S. T. ChenH. H. Wagner Letter Pages: 797 - 799