Water-assisted sub-critical crack growth along an interface between polyimide passivation and epoxy underfill Charavana K. GurumurthyEdward J. KramerChung-Yuen Hui OriginalPaper Pages: 1 - 28
Crack patterns in brittle thin films V.B. ShenoyA.F. SchwartzmanL.B. Freund OriginalPaper Pages: 29 - 45
Modeling of electromechanically-induced failure of passivated metallic thin films used in device interconnections M. Rauf GungorDimitrios Maroudas OriginalPaper Pages: 47 - 68
Fatigue and fracture properties of thin metallic foils A. HadrboletzB. WeissG. Khatibi OriginalPaper Pages: 69 - 89
Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits R.V. GoldsteinM.E. SarychevYu.V. Zhitnikov OriginalPaper Pages: 91 - 121
Creep and contact opening electromigration failures in miniaturized interconnects E.E. Glickman OriginalPaper Pages: 123 - 139