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Thermal resistance of PCD materials with borides bonding phase

  • Production, Structure, Properties
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Abstract

In these studies, one group of PCD materials has been prepared using diamond powder and 10 wt % of TiB2 and the second batch of the PCD material has been prepared using a mixture of diamond powder with 5 wt % of TiB2 and 2 wt % of Co. The materials have been sintered using a Bridgman-type high-pressure apparatus at 8.0 ± 0.2 GPa and a temperature of 2000 ± 50 °C. Thermogravimetric (TG) measurements and Differential Thermal Analysis (DTA) have been carried out for diamond micropowders, TiB2 bonding phase, and sintered composites. The coefficients of friction for diamond composites in a sliding contact with an Al2O3 ceramic ball have been determined from the room temperature up to 800°C. Material phase compositions were analyzed for initial samples and after wear tests, at the temperature of 800°C. Raman spectra of diamond composites with borides bonding phases, observed for the first-order zone center modes of diamond and graphite during heating up to 800°C in air have been presented. Thermal properties have been compared with the commercial diamond-cobalt PCD. It has been found that diamond with TiB2 and Co is the most resistant to the hardness changes at elevated temperatures and this material maintains the high hardness value up to 800°C but it has a high coefficient of friction.

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Authors and Affiliations

  1. Institute of Advanced Manufacturing Technology, 37a Wroclawska St., 30-011, Krakow, Poland

    L. Jaworska, P. Klimczyk, M. Szutkowska, P. Putyra & S. Cygan

  2. Faculty of Materials Science and Ceramics, AGH University of Science and Technology, 30 Mickiewicza Av., 30-059, Krakow, Poland

    M. Sitarz & P. Rutkowski

Authors
  1. L. Jaworska
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  2. P. Klimczyk
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  3. M. Szutkowska
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  4. P. Putyra
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  5. M. Sitarz
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  6. S. Cygan
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  7. P. Rutkowski
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Correspondence to S. Cygan.

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The text was submitted by the authors in English.

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Jaworska, L., Klimczyk, P., Szutkowska, M. et al. Thermal resistance of PCD materials with borides bonding phase. J. Superhard Mater. 37, 155–165 (2015). https://doi.org/10.3103/S1063457615030028

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  • DOI: https://doi.org/10.3103/S1063457615030028

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