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Cu-C interface systems evaluated with the help of the thermal wave contrast

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Abstract.

The effective thermal depth profiles of copper-carbon interface systems with and without additional metallic submicron bond layers have been measured by means of modulated IR radiometry and have been evaluated using a new quantity, the thermal (wave) contrast, defined with the help of the calibrated thermal wave amplitudes. Useful correlations between the thermal wave contrast and the mechanical adhesion strength between copper film and carbon substrate have been found. By comparing the measurements based on thermal wave excitation and contact-less IR detection with microscopic contact temperature measurements close to the copper-carbon interface, the similarities between the two experiments are discussed, and the advantages and problems related to the thermal wave contrast are analyzed.

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References

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Authors and Affiliations

  1. Solid State Spectroscopy, Ruhr University Bochum, 44780, Bochum, Germany

    S. Chotikaprakhan, A. Haj-Daoud, D. Dietzel, R. Meckenstock, J. Pelzl & B. K. Bein

  2. Department of Physics, Kasetsart University, Bangkok, 10900, Thailand

    S. Chotikaprakhan

  3. Palestine Academy for Science and Technology, 4577, Al-Bireh, Palestine

    A. Haj-Daoud

  4. Institute of Physics, University of Muenster, Muenster, Germany

    D. Dietzel

  5. Department of Physics, University Duisburg-Essen, 47048, Duisburg, Germany

    R. Meckenstock

  6. Austrian Research Center Seibersdorf, 2444, Seibersdorf, Austria

    E. Neubauer

Authors
  1. S. Chotikaprakhan
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  2. A. Haj-Daoud
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  3. D. Dietzel
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  4. R. Meckenstock
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  5. E. Neubauer
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  6. J. Pelzl
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  7. B. K. Bein
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Chotikaprakhan, S., Haj-Daoud, A., Dietzel, D. et al. Cu-C interface systems evaluated with the help of the thermal wave contrast. Eur. Phys. J. Spec. Top. 153, 175–178 (2008). https://doi.org/10.1140/epjst/e2008-00421-9

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  • DOI: https://doi.org/10.1140/epjst/e2008-00421-9

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