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Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation

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Abstract

The technique of nanoindentation coupled with an atomic force microscope has been used to measure mechanical properties of Cu-Sn and Ag-Sn intermetallics at length scales similar to those observed in real solder joints. This article describes the experiment and discusses the results in terms of the effect of intermetallics on the reliability of microelectronic packages. The results show that, despite their high hardness, the intermetallics deform plastically without cracking at the small loads and length scales of nanoindentation testing.

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Authors and Affiliations

  1. the Department of Materials Science and Engineering and the Materials Research Center, Lehigh University, USA

    R. R. Chromik, R. P. Vinci, S. L. Allen & M. R. Notis

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  1. R. R. Chromik
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  2. R. P. Vinci
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  3. S. L. Allen
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  4. M. R. Notis
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Additional information

For more information, contact Richard R. Chromik, Lehigh University, Materials Research Center, 5 East Packer Avenue, Bethlehem, Pennsylvania 18015; (610) 758-6879, fax (610) 758-3526, email chromik@lehigh.edu.

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Chromik, R.R., Vinci, R.P., Allen, S.L. et al. Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation. JOM 55, 66–69 (2003). https://doi.org/10.1007/s11837-003-0144-5

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