Abstract
Contact angle for millimeter-size drops of lead on {100} and {110} surfaces of monocrystalline copper and on polycrystalline copper was determined by means of dispensed drop technique at 450 °C under He-H2 atmosphere. It was demonstrated that the wetting anisotropy (a difference between contact angles on differently oriented substrates) is not exceed a few degrees. Spreading kinetics was found to be different for the first and second drops deposited on each substrate. This result was interpreted as an effect of a lead precursor film formation on the substrate surface. Molecular dynamics simulations of the lead drop spreading over {111}, {100}, and {110} surfaces of monocrystalline copper confirm the weak anisotropy of equilibrium contact angle and a formation of lead precursor film on copper surface in front of wetting line.
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Acknowledgments
The authors are gratefully acknowledged Dr. S. I. Prokofjev and Prof. B.B. Straumal from ISSP RAS (Chernogolovka) for kindly supplied copper monocrystals. Financial support of Russian Foundation for Basic Research under Grant No. 11-08-01244-a is kindly acknowledged. The calculations were performed by using ‘Chebyshev’ SKIF MSU supercomputer.
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This article is an invited submission to JMEP selected from presentations at the Symposia “Wetting, soldering and brazing” and “Diffusion bonding and characterization” belonging to the Topic “Joining” at the European Congress and Exhibition on Advanced Materials and Processes (EUROMAT 2011), held September 12-15, 2011, in Montpellier, France, and has been expanded from the original presentation.
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Timoshenko, V., Bochenkov, V., Traskine, V. et al. Anisotropy of Wetting and Spreading in Binary Cu-Pb Metallic System: Experimental Facts and MD Modeling. J. of Materi Eng and Perform 21, 575–584 (2012). https://doi.org/10.1007/s11665-012-0184-5
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DOI: https://doi.org/10.1007/s11665-012-0184-5