Abstract
Various Sn-doped famatinite (Cu3Sb1−ySnyS4, 0 ≤ y ≤ 0.1) specimens were prepared by employing a mechanical alloying and hot-pressing method. The phase transitions, microstructures, and thermoelectric properties, i.e., the electrical conductivity, Seebeck coefficient, power factor, thermal conductivity, Lorenz number, and figure of merit, were examined. The famatinite phase with a tetragonal structure was stable below its melting point, as no secondary phases were present; however, it transformed to skinnerite Cu3SbS3 at higher temperatures. Sn doping reduced the melting point from 817 K (Cu3SbS4) to 815 K (Cu3Sb0.92Sn0.08S4). Hot-pressed compacts exhibited relative densities of 97.1–99.5%. Because Sn replaced at Sb sites, the a-axis slightly reduced, and the c-axis increased. Cu3SbS4 exhibited non-degenerate semiconductor behavior, and possessed a low dimensionless figure of merit (ZT) of 0.1 at 623 K; these phenomena were products of the power factor of 0.14 mW m−1 K−2 and thermal conductivity of 0.62 W m−1 K−1. Conversely, the Sn-doped specimens exhibited degenerate semiconductor characteristics. As the Sn content increased, the electrical and thermal conductivities and power factor increased, whereas the Seebeck coefficient decreased. The thermoelectric performance was significantly enhanced by Sn doping. The highest ZT (0.67 at 623 K) was obtained for Cu3Sb0.92Sn0.08S4, and it was a product of implementing a power factor of 0.94 mW m−1 K−2 and thermal conductivity of 0.86 W m−1 K−1.
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Acknowledgments
This study was supported by the Industrial Core Technology Development Program funded by the Ministry of Trade, Industry and Energy (Grant No. 10083640), and by the Basic Science Research Capacity Enhancement Project (National Research Facilities and Equipment Center) through the Korea Basic Science Institute funded by the Ministry of Education (Grant No. 2019R1A6C1010047).
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Pi, JH., Lee, GE. & Kim, IH. Effects of Sn-Doping on the Thermoelectric Properties of Famatinite. J. Electron. Mater. 49, 2755–2761 (2020). https://doi.org/10.1007/s11664-019-07710-9
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DOI: https://doi.org/10.1007/s11664-019-07710-9