Abstract
The physical properties, solderability, and creep-rupture life of the nanosized Ag particle-reinforced Sn-Pb composite solder were investigated. The experimental results indicate that the composite solder possesses good electrical conductivity as well as good solderability. Compared to the eutectic 63Sn-37Pb solder matrix, the nanosized Ag particle-reinforced composite solder improved the creep resistance and significantly enhanced the creep-rupture life of its solder joints. The fracture surface revealed a mixture of ductile and brittle fracture features.
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Liu, J.P., Guo, F., Yan, Y.F. et al. Development of creep-resistant, nanosized Ag particle-reinforced Sn-Pb composite solders. J. Electron. Mater. 33, 958–963 (2004). https://doi.org/10.1007/s11664-004-0022-0
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DOI: https://doi.org/10.1007/s11664-004-0022-0