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Measurement of Temperature-Dependent Young’s Modulus at a Strain Rate for a Molding Compound by Nanoindentation

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Abstract

The mechanical properties of a molding compound on a packaged integrated circuit (IC) were measured by spherical nanoindentation using a 50 μm radius diamond tip. The molding compound is a heterogeneous material, consisting of assorted diameters of glass beads embedded in an epoxy. Statistical analysis was conducted to determine the representative volume element (RVE) size for a nanoindentation grid. Nanoindentation was made on the RVE to determine the effective viscoelastic properties. The relaxation functions were converted to temperature-dependent Young’s modulus at a given strain rate at several elevated temperatures. The Young’s modulus values at a given strain rate from nanoindentation were found to be in a good agreement with the corresponding data obtained from tensile samples at or below 90 °C. However, the values from nanoindentation were significantly lower than the data obtained from tensile samples when the temperature was near or higher than 110 °C, which is near the glass transition. The spatial distribution of the Young’s modulus at a given strain rate was determined using nanoindentation with a Berkovich tip. The spatial variation of the Young’s modulus at a given strain rate is due to the difference in nanoindentation sites (glass beads, epoxy or the interphase region). A graphical map made from an optical micrograph agrees reasonably well with the nanoindentation results.

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Acknowledgments

We acknowledge the support of Texas Instruments, NSF under ECCS-1307997, and DOE under NEUP 09–818. Lu also thanks the Louis A. Beecherl Jr., Chair for additional support. We thank Dr. Dani Z. Fadda for editing the manuscript.

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  1. Department of Mechanical Engineering, The University of Texas at Dallas, Richardson, TX, 75080, USA

    T. Xu, Y. Du, H. Luo, G. -H. Kim, Z. Xu, M. Minary-Jolandan, T. Baughn & H. Lu

  2. Texas Instruments Incorporated, Dallas, TX, 75266, USA

    L. Stark

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  1. T. Xu
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Xu, T., Du, Y., Luo, H. et al. Measurement of Temperature-Dependent Young’s Modulus at a Strain Rate for a Molding Compound by Nanoindentation. Exp Mech 57, 1135–1147 (2017). https://doi.org/10.1007/s11340-016-0205-7

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