Abstract
Present processes for generating metallized patterns for microcircuitry involve many steps including mask fabrication. Maskless metallization of patterns at acceptable resolution would reduce the number of processing steps, add flexibility to the production scheme and facilitate repair of circuitry. Laser enhanced deposition of gold and other metals is believed to represent a significant advance in this field.
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References
R. J. von Gutfeld, E. E. Tynan, R. L. Melcher and S. E. Blum,Appl. Phys. Lett., 1979,35, 651–653
R. J. von Gutfeld, E. E. Tynan and L. T. Romankiw, Abstr. 472, Electrochem. Soc. Extend. Abstr. Los Angeles, CA., 79–2, 1979, pp. 1185–1187
R. J. von Gutfeld and J.-Cl. Puippe,Oberfläche-Surf, 1981,22, 294–298
J.-Cl. Puippe, R. E. Acosta and R. J. von Gutfeld,J Electrochem. Soc., 1981,128, 2539–2545
R. J. von Gutfeld, R. E. Acosta and L. T. Romankiw,IBM J. Res. Dev., 1982,26, (2), 136–144
R. J. von Gutfeld, M. Gelchinski and L. T. Romankiw, RNP 663, Electrochem. Soc., Denver, CO.,J. Electrochem. Soc., 1981,128, 448C
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von Gutfeld, R.J., Romankiw, L.T. Laser enhanced plating. Gold Bull 15, 120–123 (1982). https://doi.org/10.1007/BF03214615
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DOI: https://doi.org/10.1007/BF03214615