A fractographic criterion for subcritical crack-growth boundaries in hot-pressed alumina

Abstract

The percent intergranular fracture (PIF) was measured along radii extending from fracture origins in hot-pressed alumina specimens, fractured at various loading rates and temperatures, and plotted versus estimates of stress intensity factors (K _I) at the various crack lengths. Minima in PIF occur at values ofK _I that are close to the critical stress intensity factors (K _IC) for cleavage on various crystal lattice planes in sapphire. The subcritical crack-growth boundary (K _I=K _IC of the polycrystalline material) occurs near the primary minimum in PIF suggesting that this minimum can be used as a criterion for locating this boundary. In addition, it was noted that the polycrystallineK _IC (4.2 MPa m^1/2) is very close to theK _IC for fracture on {¯1 ¯1 2 6} planes which is 4.3 MPa m^1/2. These observations suggest that critical crack growth begins when increased fracture energy can no longer be absorbed by cleavage on these planes. There is a secondary minimum atK _I>K _IC that appears to be associated with theK _IC necessary for fracture on combinations of planes selected by the fracture as alternatives to the high fracture-toughness basal plane.