Abstract
Based on first-principles calculations, the effect of Cu solubility on the elastic moduli of Ni3Sn4-based intermetallic compound (IMC) is investigated. It is found that the stiffness tensor of a (Ni,Cu)3Sn4 single crystal is anisotropic, and the presence of Cu in the crystal compound reduces the moduli of (Ni,Cu)3Sn4 due to reduced hybridization between Ni and Sn states. Furthermore, our results show that higher Cu concentration in the (Ni,Cu)3Sn4-based IMCs leads to thermodynamically less stable compounds. Based on the single-crystal results, the elastic properties of polycrystalline (Ni,Cu)3Sn4 are also obtained.
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Gao, F., Qu, J. Elastic Moduli of (Ni,Cu)3Sn4 Ternary Alloys from First-Principles Calculations. J. Electron. Mater. 39, 2429–2434 (2010). https://doi.org/10.1007/s11664-010-1338-6
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DOI: https://doi.org/10.1007/s11664-010-1338-6