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Investigation of the influence of inert and oxidizing atmospheres on the efficiency of decomposition of waste printed circuit boards (WPCBs)

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Abstract

Thermo-gravimetry was used for studying the influence of the furnace atmosphere during the pyrolysis waste circuit boards (WPCBs). Pyrolysis in argon atmosphere resulted in a continuous decrease of mass of the sample. Rapid mass loss occurred at about 573 K. Heating the WPCBs in air and oxygen atmospheres resulted in an increase in the mass of the sample in the early stages until rapid mass loss occurred at about 573 K. When pyrolysis of larger sample mass (about 5 g each) was carried out in tubular furnace, about 20.43 % mass loss was observed during the pyrolysis of WPCBs in a flowing stream of argon at 548 K during a period of 4 min. On the other hand, a maximum of about 2.26 % mass loss was recorded when the WPCBs were heated at about 600 K for the same time interval in the still air. The mass transfer during the pyrolysis of WPCBs in flowing stream of inert gas was also modeled. It is found that controlling the flow rate of inert gas and the geometry of the equipment can enhance the rate of mass loss significantly.

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References

  1. http://rajyasabha.nic.in/rsnew/publication_electronic/E-Waste_in_india.pdf

  2. Molto J, Font R, Galvez A, Conesa JA (2008) Pyrolysis and combustion of electronic wastes. J Anal Appl Pyrolysis. doi:10.1016/j.jaap.2008.10.023

    Google Scholar 

  3. Li J, Duan H, Yu K, Liu L, Wang S (2010) Characteristic of low-temperature pyrolysis of printed circuit boards subjected to various atmosphere. Resour Conserv Recycl 54:810–815

    Article  Google Scholar 

  4. Guo Q, Yue X, Wang M, Liu Y (2010) Pyrolysis of scrap printed circuit boards plastic particles in a fluidized bed. Powder Technol 198:422–428

    Article  Google Scholar 

  5. Zhan Z-H, Qiu K-Q (2011) Vacuum pyrolysis characteristics of waste epoxy printed circuit boards. J Chongqing Univ 10(3):113–122

    Google Scholar 

  6. Zhan Z-H, Qiu K-Q (2011) Pyrolysis kinetics and TG-FTIR analysis of waste epoxy printed circuit boards. J Cent South Univ Technol 18:331–336

    Article  Google Scholar 

  7. Molto J, Egea S, Conesa JA, Font R (2011) Thermal decomposition of electronic wastes: mobile phone case and other parts. Waste Manag 31:2546–2552

    Article  Google Scholar 

  8. Wang J, Li Y, Jin Y, Wang Z (2014) Kinetics and mechanism of thermal decomposition of polyepoxyphenylsilsesquioxane/epoxy resin systems from isothermal measurement. J Macromol Sci Part A Pure Appl Chem 51:249–253

    Article  Google Scholar 

  9. http://www.chem.mtu.edu/~fmorriso/cm3215/HeiserChartArticleTransASME1947.pdf

  10. Knacke O, Kubaschaski O, Hesselmann O (1991) Themochemical properties of inorganic substances, 2nd edn. Springer, Berlin

    Google Scholar 

  11. Xiao H, Chi Y, Buekens A (2013) Combustion characteristics of waste printed circuit boards in thermogravimetric analyzers. Environ Prog Sustain Energy. doi:10.1002/ep

    Google Scholar 

  12. http://cameochemicals.noaa.gov/chris/PHN.pdf

  13. Zhou Y, Wu W, Qiu K (2011) Recycling of organic materials and solder from waste printed circuit boards by vacuum pyrolysis-centrifugation coupling technology. Waste Manag 31:2569–2576

    Article  Google Scholar 

  14. Feng Z, Marks CR, Barkatt A (2003) Oxidation-rate excursions during the oxidation of copper in gaseous environment at moderate temperatures. Oxid Met 60:393–408

    Article  Google Scholar 

  15. Galloway JE, Miles BM (1997) Moisture absorption and desorption predictions for plastic ball grid array packages, ieee transactions on components. Part A Packag Manuf Technol 20(3):274–279

    Article  Google Scholar 

  16. Sood B, Pecht M Controlling moisture in printed circuit boards. Published in the IPC printed circuit expo, APEX & designer summit proceedings. http://www.superdrytotech.com/technical_articles/CALCE%20best_practices_controlling_moisture_PCB.pdf

  17. Teverovsky A, A rapid technique for moisture diffusion characterization of molding compounds in PEMs, QSS Group, Inc./Goddard Operations. https://www.google.co.in/webhp?sourceid=chrome-instant&ion=1&espv=2&ie=UTF8#q=alexander+teverovsky+moisture+%22PEMs%22+%22rapid+technique%22

  18. http://www.engineeringtoolbox.com/specific-heat-capacity-d_391.html

  19. http://www.technicalglass.com/technical_properties.html

  20. Long L, Sun S, Zhong S, Dai W, Liu L, Song W (2010) Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards. J Hazard Mater 177:626–632

    Article  Google Scholar 

  21. Williams PT (2010) Valorization of printed circuit boards from waste electrical and electronic equipment by pyrolysis. Waste Biomass Valoriz 1:107–120. doi:10.1007/s12649-009-9003-0

    Article  Google Scholar 

  22. Malathi M, Godiwalla KM, Kumar A, Chacko EZ, Ajmani SK, Ranganathan S (2014) Generation of magnesium for in situ desulphurisation investigation on influence of inert gas flow rate. Miner Proc Extr Metall 123(2):67–74

    Article  Google Scholar 

  23. https://books.google.co.in/books?isbn=0891168699

  24. Bird RB, Stewart WE, Lightfoot EN (1960) Transport phenomena, 1st edn. Wiley, Tokyo

    Google Scholar 

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Acknowledgments

One of the authors Ms. Anjan Kumari is thankful to Director, NML, Jamshedpur for providing NML facilities and permission to published the work. The authors are thankful to Dr. K. M. Godiwalla and Mr. Santosh Kumar, CSIR-National Metallurgical Laboratory, Jamshedpur, for their support during the experimental work.

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Authors and Affiliations

  1. Metal Extraction and Forming Division, CSIR-National Metallurgical Laboratory, Jamshedpur, 831007, India

    Anjan Kumari, Manis Kumar Jha & S. Ranganathan

  2. Department of Metallurgical and Materials Engineering, National Institute of Technology, Jamshedpur, 831014, India

    Anjan Kumari & Rajendra Prasad Singh

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  1. Anjan Kumari
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  2. Manis Kumar Jha
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  3. Rajendra Prasad Singh
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  4. S. Ranganathan
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Correspondence to Manis Kumar Jha.

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Kumari, A., Jha, M.K., Singh, R.P. et al. Investigation of the influence of inert and oxidizing atmospheres on the efficiency of decomposition of waste printed circuit boards (WPCBs). Heat Mass Transfer 53, 1247–1255 (2017). https://doi.org/10.1007/s00231-016-1888-0

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  • DOI: https://doi.org/10.1007/s00231-016-1888-0

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