Abstract
The total variability observed in the measured data may come from different sources. They may be wafer-to-wafer, die-to-die, intra-die, and may come from systematic or random sources.
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References
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Neuberger, G., Wirth, G., Reis, R. (2014). Systematic and Random Variability. In: Protecting Chips Against Hold Time Violations Due to Variability. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-2427-3_7
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DOI: https://doi.org/10.1007/978-94-007-2427-3_7
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