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Development of DRIE for the Next Generation of MEMS Devices

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Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators

Abstract

This paper describes methods to increase the aspect ratio of features whilst maintaining a high throughput using DRIE technology. The component parts of the Bosch process are considered with the aim to increase the efficiency of each step. By controlling process parameters within a cycle and cycle to cycle, etch rate and aspect ratio can be increased.

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References

  1. F. Larmer, R. Schlip, German Patent DE4241045.

    Google Scholar 

  2. C. C. Wang, Y. L. Lin, S. K. Lin, C. S. Li, H. K. Hiuang, C. L. Wu, C. S. Chang, Y. H. Wang, Journal Vacuum Science and Technology, B 25 (2), 312–317 (2004).

    Google Scholar 

  3. M. J. de Boer, J. G. E. Gardeniers, H. V. Jansen, E. Smulders, M. Gilde, G. Roelofs, J. N. S. Sasserath, M. Elwenspoek, Journal Microelectromechanical Systems, 11(4), 385–401 (2002).

    Article  CAS  Google Scholar 

  4. B. N. Chapman, Glow Discharge Processes, New York, Wiley Press (1980).

    Google Scholar 

  5. www.stsystems.com

  6. S. Gomez, R. J. Belen, M. Kiehlbauch, E. S. Aydil, Journal Vacuum Science and Technology, B 22 (3), 893–901 (2004).

    Google Scholar 

  7. www.quantemol.com

  8. C. B. Labelle, V. M. Donelly, G. R. Bogart, R. L. Opila, A. Kornblit, Journal Vacuum Science and Technology, A 22 (6), 2500–2507 (2004).

    Article  Google Scholar 

  9. H. Rhee, H. M. Lee, Y. M. Namkoung C. Kim, H. Chae, Y. W. Kim, Journal Vacuum Science and Technology, B 27 (1), 33–40 (2009).

    Article  Google Scholar 

  10. J. Min, G. Lee, J. Lee, S. H. Moon, Journal Vacuum Science and Technology, B 22 (3), 893–901 (2004).

    Article  Google Scholar 

  11. M. A. Blauw, T. Zijlstra, E. van der Drift, Journal Vacuum Science and Technology, B 19 (6), 2930–2934 (2001).

    Article  Google Scholar 

  12. R. Abdolvand, F. Ayazi, Sensors and Actuators A, 144, 109–116 (2008).

    Article  Google Scholar 

  13. M. A. Blauw, G. Craciun, W. G. Sloof, P. J. French, E. van der Drift, Journal Vacuum Science and Tecnology, B 20 (6), 3106–3110 (2002).

    Article  Google Scholar 

  14. A. Grill, Cold Plasma in Materials fabrication From Fundamentals to Applications, IEEE Press (1994).

    Google Scholar 

  15. Yole Report, MEMS for Mobiles (2006).

    Google Scholar 

  16. I. W. Rangelow, Journal Vacuum Science and Technology, A 21 (4), 1550–1562 (2003).

    Article  Google Scholar 

  17. J. Hopkins, H. Ashraf, J. K. Bhardwai, A. M. Hynes, I. Johnston, J. N. Shepherd, Proceedings of Materials Research Society Symposium on Materials Science of Microelectromechanical Systems (MEMS) Devices, 546, 63–68 (1999).

    CAS  Google Scholar 

  18. A. A. Ayon, X. Zhang, R. Khanna, Sensors and Actuators, A 91, 381–385 (2001).

    Google Scholar 

  19. J. Bhardwaj, H. Ashraf, B. Khamesphour, J. Hopkins, M. Ryan, D. Haynes, US Patent 6051503.

    Google Scholar 

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Acknowledgments

The authors would like to acknowledge the Process and R&D groups in STS for their contribution to the ongoing development of the DRIE process.

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Authors and Affiliations

  1. SPP Process Technology Systems UK Limited, Imperial Park, Newport, UK

    H. Ashraf, J. Hopkins & L. M. Lea

Authors
  1. H. Ashraf
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  2. J. Hopkins
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  3. L. M. Lea
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Corresponding author

Correspondence to H. Ashraf .

Editor information

Editors and Affiliations

  1. Qualcomm MEMS Technologies, Inc., Junction Avenue 2581, San Jose, 95134, USA

    Evgeni Gusev

  2. Inst. Advanced Materials Devices &, Nanotechnology, Rutgers University, Taylor Road 610, Piscataway, 08854, USA

    Eric Garfunkel

  3. A.E Ioffe Physico-Technical Institute, Russian Academy of Sciences, Polytekhnicheskaya ul. 26, St. Petersburg, 194021, Russian Federation

    Arthur Dideikin

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© 2010 Springer Science+Business Media B.V.

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Ashraf, H., Hopkins, J., Lea, L.M. (2010). Development of DRIE for the Next Generation of MEMS Devices. In: Gusev, E., Garfunkel, E., Dideikin, A. (eds) Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. NATO Science for Peace and Security Series B: Physics and Biophysics. Springer, Dordrecht. https://doi.org/10.1007/978-90-481-3807-4_12

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  • DOI: https://doi.org/10.1007/978-90-481-3807-4_12

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  • Publisher Name: Springer, Dordrecht

  • Print ISBN: 978-90-481-3805-0

  • Online ISBN: 978-90-481-3807-4

  • eBook Packages: Physics and AstronomyPhysics and Astronomy (R0)

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