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Investigation of Ion Implantation Damage with Stress Measurements

  • Conference paper
Ion Implantation in Semiconductors

Abstract

The stress set up lateral to the implanted surface by ion implantation lattice damage is measured for 220 keV 4He, 12C, 16O, 20Ne, 27Al, 40Ar, 84Kr, and Xe room temperature implants into Si. It is found that the ions with atomic number greater than Si produce more damage per given energy density deposited into atomic processes E than the lighter ions and produce damage almost linearly with E up to a distinct maximum in the stress. The measurements from 4He, 12C, 16O, 20Ne, 27Al implants are indistinguishable from one another at low E values where the damage depends linearly upon E. These lighter ions introduce damage sublinearly with E at medium E values. The maximum in all the stress versus E results is taken as evidence for an elastic-plastic transition in the implanted layer. This elastic-plastic transition is correlated with what others have called the crystalline-to-amorphous transition.

This work was supported by the U.S. Atomic Energy Commission.

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Ingolf Ruge (Professor an der Technischen Universität München)Jürgen Graul (Wissenschaftlicher Mitarbeiter am Institut für Technische Elektronik der Technischen Universität München)

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© 1971 Springer-Verlag, Berlin · Heidelberg

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EerNisse, E.P. (1971). Investigation of Ion Implantation Damage with Stress Measurements. In: Ruge, I., Graul, J. (eds) Ion Implantation in Semiconductors. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-80660-5_5

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  • DOI: https://doi.org/10.1007/978-3-642-80660-5_5

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-80662-9

  • Online ISBN: 978-3-642-80660-5

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