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Analysis of Electromechanical Microdevices Using Coupled FEM-BEM Based on the TP2000 CAD Platform

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High Performance Scientific and Engineering Computing

Part of the book series: Lecture Notes in Computational Science and Engineering ((LNCSE,volume 8))

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Abstract

We describe and demonstrate the capabilities of a new coupled-field simulator which is based on the industrial CAD platform TP2000 and especially dedicated to the multidimensional numerical analysis of the operation of electromechanical microdevices. The coupling of the finite element and the boundary element methods makes the simulation tool particularly suited for microdevices where movable parts are deflected, displaced, or rotated by electrostatic forces. As an illustrative example, we study the fully coupled electro-mechanical behaviour of a deflectable micromirror.

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References

  1. Hoppe, R.H.W., Sieber, E.-R., Wachutka, G., Wiest, U.: Mathematical Modeling and Numerical Simulation of a Free Boundary Problem for an Electromechanical Micropump. Rep. No. 358, Institut fur Mathematik, Universität Augsburg, Germany (1996)

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  4. Jaecklin, V.P., Linder, C., de Rooij, N.F., Moret, J.-M., Vuilleumier, R.: Line-addressable torsional micromirrors for light modulator arrays. Sensors and Actuators A41-42 (1994) 324–329

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Author information

Authors and Affiliations

  1. Institute for Physics of Electrotechnology, Munich University of Technology, 80290, Munich, Germany

    E.-R. König & G. Wachutka

  2. IGF Ingenieursozietät Groth - Faiss, 72793, Pfullingen, Germany

    P. Groth

Authors
  1. E.-R. König
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  2. P. Groth
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  3. G. Wachutka
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Editor information

Editors and Affiliations

  1. Institut für Informatik, Technische Universität München, D-80290, München, Germany

    Hans-Joachim Bungartz

  2. Lehrstuhl für Strömungsmechanik, Friedrich-Alexander-Universität Erlangen-Nürnberg, Cauerstraße 4, D-91058, Erlangen, Germany

    Franz Durst

  3. Institut für Informatik, Technische Universität München, D-80290, München, Germany

    Christoph Zenger

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© 1999 Springer-Verlag Berlin Heidelberg

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König, ER., Groth, P., Wachutka, G. (1999). Analysis of Electromechanical Microdevices Using Coupled FEM-BEM Based on the TP2000 CAD Platform. In: Bungartz, HJ., Durst, F., Zenger, C. (eds) High Performance Scientific and Engineering Computing. Lecture Notes in Computational Science and Engineering, vol 8. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-60155-2_32

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  • DOI: https://doi.org/10.1007/978-3-642-60155-2_32

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-540-65730-9

  • Online ISBN: 978-3-642-60155-2

  • eBook Packages: Springer Book Archive

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