Abstract
Accurate measurements are essential in high-frequency engineering. Depending on the functionality of the device under test (DUT), different types of measurements are required. Linear characteristics of microwave circuits and devices are usually measured using a vector network analyzer (VNA). The obtained S-parameters are used to describe the main performance characteristics of the networks operating in their linear range. For example, for an LNA the small-signal S-parameters describe its gain, reverse isolation and port matching. Also for instance, the main properties of a directional coupler such as e.g. amplitude and phase imbalance, insertion loss, isolation and port matching can be derived from its S-parameters.
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References
L.Martens, High-frequency characterization of electronic packaging, chapter 3.5.3, Springer, 1998.
M. C. A. M. Koolen, J. A. M. Geelen, and M. P. J. G. Versleijen, “An Improved Deembedding Technique for On-Wafer High-Frequency Characterization”, in Proc. Bipolar / BiCMOS Circuits and Technology Meeting (BCTM), pp. 188--191, Minneapolis, USA, September 1991.
L. F. Tiemeijer, R. J. Havens, A. B. M. Jansman, and Y. Bouttement, “Comparison of the ”Pad-Open-Short” and ”Open-Short-Load” deembedding techniques for accurate on-wafer rf characterization of high-quality passives”, IEEE Transactions on Microwave Theory and Techniques, vol. 51, pp. 723--729, February 2005.
Y. Tretiakov, K. Vaed, W. Woods, S. Venkatadri, and T. Zwick, “A New On-Wafer De-Embedding Technique for On-Chip RF Transmission Line Interconnect Characterization”, in Proc. IEEE 63rd ARFTG Conference, pp. 69--72, Fort Worth, USA, June 2004.
A. Issaoun, Y. Z. Xiong, J. Shi, J. Brinkhoff, and F. Lin, “On the Deembedding Issue of CMOS Multigigahertz Measurements”, IEEE Transactions on Microwave Theory and Techniques, vol. 55, pp. 1813--1823, September 2007.
J. Song, F. Ling, G. Flynn, W. Blood, and E. Demircan, “A De-embedding Technique for Interconnects”, in Proc. IEEE Elec. Perf. of Electronic Packaging, pp. 129--132, Cambridge, USA, October 2001.
M. B. Steer, S. B. Goldberg, G. Rinne, P. D. Franzon, I. Turlik, and J. S. Kasten, “Introducing the through-line deembedding procedure”, in IEEE MTT-S International Microwave Symposium (IMS) Digest, pp. 1455--1458, Albuquerque, USA, June 1992.
G. F. Glenn and C. A. Hoer, “Thru-reflect-line: An improved technique for calibrating the dual six-port automatic network analyzer”, IEEE Transactions on Microwave Theory and Techniques, vol. 27, pp. 987--993, December 1979.
V. Issakov, M. Wojnowski, A. Thiede, and L. Maurer, “Extension of Thru De-embedding Technique for Asymmetrical and Differential Devices”, IET Circuits, Devices & Systems, vol. 3, pp. 91--98, April 2009.
D. E. Bockelman and W. R. Eisenstadt, “Combined Differential and Common-Mode Scattering Parameters: Theory and Simulation”, IEEE Transactions on Microwave Theory and Techniques, vol. 43, pp. 1530--1539, July 1995.
T. Zwick and U. Pfeiffer, “Pure-mode network analyzer concept for on-wafer measurements of differential circuits at millimeter-wave frequencies”, IEEE Transactions on Microwave Theory and Techniques, vol. 53, pp. 934--937, March 2005.
C. Seguinot, P. Kennis, J.-F. Legier, F. Huret, E. Paleczny, and L. Hayden, “Multimode TRL - A New Concept inMicrowaveMeasurements: Theory and Experimental Verification”, IEEE Transactions on Microwave Theory and Techniques, vol. 46, pp. 536--542, May 1998.
D.-H. Han, T. Q. Ruttan, and L. A. Polka, “Differential de-embedding methodology for on-board CPU socket measurements”, in Proc. IEEE 61st ARFTG Conference, pp. 37--43, Philadelphia, USA, June 2003.
V. Issakov, M.Wojnowski, A. Thiede, and R.Weigel, “Considerations on the De-embedding of Differential Devices Using Two-Port Techniques”, in European Microwave Conference (EuMC), pp. 695--698, Rome, Italy, October 2009.
A. G. Chiariello, A. Maffucci, G. Miano, F. Villone, and W. Zamboni, “A Transmission- Line Model for Full-Wave Analysis of Mixed-Mode Propagation”, IEEE Transactions on Advanced Packaging, vol. 31, pp. 275--284, February 2008.
O. Zinke and H. Brunswig, Hochfrequenztechnik 1, chapter 4.11, Springer Verlag, 6th edition, 2000.
R. B. Marks, “A multiline method of network analyzer calibration”, IEEE Transactions on Microwave Theory and Techniques, vol. 39, pp. 1205--1215, July 1991.
D. Pozar, Microwave Engineering, Wiley, 2nd edition, 1998.
J. C. Tippet and R. A. Speciale, “A Rigorous Technique or Measuring the Scattering Matrix of a Multiport Device with a 2-port Network Analyzer”, IEEE Transactions on Microwave Theory and Techniques, vol. 30, pp. 661--666, May 1982.
S. Belkin, “Differential Circuit Characterization with Two-Port S-Parameters”, IEEE Microwave Magazine, vol. 7, pp. 86--99, December 2006.
M. Spirito, M. P. van der Heijden, M. de Kok, and L. C. N. de Vrede, “A calibration procedure for on-wafer differential load-pull measurements”, in Proc. IEEE 61st ARFTG Conference, pp. 1--4, Philadelphia, USA, June 2003.
V. A. Monaco and P. Tiberio, “Computer-Aided Analysis of Microwave Circuits”, IEEE Transactions on Microwave Theory and Techniques, vol. 22, pp. 249--263, March 1974.
K. C. Gupta, R. Garg, and R. Chadha, Computer-Aided Design of Microwave Circuits, chapter 11.2.2, Artech House, 1981.
V. Issakov, H. Knapp, M. Wojnowski, A. Thiede, W. Simbürger, G. Haider, and L. Maurer, “ESD-protected 24 GHz LNA for Radar Applications in SiGe:C Technology”, in Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF), pp. 1--4, San Diego, USA, January 2009.
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Issakov, V. (2010). Measurement Techniques. In: Microwave Circuits for 24 GHz Automotive Radar in Silicon-based Technologies. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-13598-9_5
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DOI: https://doi.org/10.1007/978-3-642-13598-9_5
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