Abstract
PVD (physical vacuum deposition) methods are the following: [1]: Vacuum evaporation, Ion plating, Cathodic sputtering. These three techniques are also used in reactive processes for coatings with chemical compounds, as well as molecular beam epitaxy [1–5], which is a variant of vacuum evaporation. With ion implantation [6–10], one can change the properties of solid surfaces without coatings. This is not a coating process.
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References
Mattox DM (2010) Handbook of Physical Vapor Deposition (PVD) Processing, 2nd edn. William Andrew,
Cho JA (1971) Film Deposition by Molecular Beam Techniques. J Vac Sci Tech 8:S31–S38
Cho JA (1975) Molecular Beam Epitaxy. Prog Solid-State Chem 10:157–192
Sacks R, Sieg R, Ringel S (1996) Investigation of the Accuracy of Pyrometric Interferometry in Determining \(\mathrm{Al}_{x}\mathrm{Ga}_{1-x}\mathrm{As}\) Growth Rates and Compositions. J Vac Sci Tech B 12(3):2157–2162
Pinsukanjana P, Jackson A, Tofte J, Maranowski K, Campbell S, English J, Chalmers S, Coldren L, Gossard A (1996) Real-time Simultaneous Optical-Based Flux Monitoring of Al, Ga, and In using Atomic Absorption for Molecular Beam Epitaxy. J Vac Sci Tech B 14(3):2147–2150
Williams JS, Poate JM (eds) (1984) Ion Implantation and Beam Processing. Academic Press,
Ziegler F (1996) Ion Implantation Science and Technology. , Edgewater, USA
Hilleringmann U (2004) Silizium-Halbleitertechnologie. Teubner,
Frey H (1992) Ionenstrahlgestützte Halbleitertechnologie. VDI-Verlag, Düsseldorf
Marshall A, Natarajan S (2002) SOI Design: Analog, Memory and Digital Techniques. Springer,
Burrows G (1965) Evaporation in an evacuated container. Vacuum 15(8):289–399
Langmuir J (1973) The vapour pressure of metallic tungsten. Phys Rev 2(5):329–342
Movcan BA, Domcisin AV, Kulak LD (1974) Structure and mechanical properties of thick Fe, Fe-NbC, Fe-Ni-NbC- condensates. J Vac Sci Technol 11:869–874
Schiller, S., et al. Erfahrungen mit einem 5 kW Elektronenstrahlverdampfer, Vakuum-Technik 16 (167/ 9), pp. 205–209
Taylor RC (1974) Single source evaporation of gadolinium cobalt alloys. J Vac Sci Technol 11(6):1148–1150
Oron, M.; Adams, C.M.: Controlled electron beam co-deposition of copper-nickel films J. Mater. Sci. 4 (169), pp. 252–258.
Swift RA, Noval BA, Merz KM (1968) Fractionation of Ni-Cr-Cu-Al alloys during vacuum evaporation. J Vac Sci Technol 5(3):79–83
Santala T, Adams CM (1970) Kinetics and thermodynamics in continuous electron-beam evaporation of binary alloys. J Vac Sci Technol 7(6):22–29
Forster JS, Pfeifer WH (1972) Vacuum deposition of alloys – theoretical and practical considerations. J Vac Sci Technol 9(6):1379–1384
Andreini RJ, Forster JS (1974) Kinetics of solute removal during electron-beam and vacuum-arc melting. J Vac Sci Technol 11(6):1055–1059
Hulgren C et al (1963) Selected Values of Thermodynamic Properties of Metals and Alloys. J. Wiley & Sons Inc., New York, p 732
Wagner C (1962) Thermodynamics of Alloys. Addision-Wesley, Reading, Mass., pp 15–17
Olette M (1960) Élemination sous vide des oligo-élémentes contenus dans les alliages ferreux. Mem Sci Rev Met 67(6):467–480
Richards JL (1966) Flash-evaporation. In: Anderson JC (ed) The Use of Thin Films in Physical Investigations. Academic Press, New York, pp 71–85
Harker HR, Hill RJ (1972) The deposition of multicomponent phases by ion plating. J Vac Sci Technol 9(6):1365–1399
Smith HR, Kennedy K, Boericke FS (1970) Metallurgical characteristics of titanium-alloy foil prepared by electron beam evaporation. J Vac Sc Technol 7(6):48–51
Krutenat RC (1974) Effect of pool temperature gradients on the compositions of electron beam vapour deposited alloys. J Vac Sci Technol 11(6):1123
Stowell WR (1973) Single source evaporation of a niobium based alloy containing volatile constituents. J Vac Sci Technol 10(4):489–493
Hoffmann D, Leibowitz D (1971) \(\mathrm{Al}_{2}\mathrm{O}_{3}\) Films prepared by electron beam evaporation of hot pressed \(\mathrm{Al_{2}O_{3}}\) in oxygen ambient. J Vac Sci Technol 8(1):107–111
Hoffmann D, Leibowitz D (1972) Effect of substrate potential on \(\mathrm{Al_{2}O_{3}}\) films prepared by electron beam evaporation. J Vac Sci Technol 9(1):326–329
Bunshab RF, Raghuran AC (1972) Activated reactive evaporation process for high rate deposition of compounds. J Vac Sci Technol 9(6):1385–1388
Stowell WR (1974) Ion-plated titanium carbide coatings. Thin Solid Films 22(1):111–120
Mattox DM (1973) Thin film metallization of oxides in microelectronics. Thin Solid Films 18(2):173–186
Heitmann E (1972) Reaktives Aufdampfen in reaktiven Gasen. Vakuum-Technik 21(1):1–11
Ramprasad, B.S.; Rhada, T.S.: Optimum geometry for uniform deposits on a rotating substrates from a pint source Vacuum 24 (1974) 4, p. 165
Graper EB (1973) Distribution and apparent source geometrie of electron-beam-broad evaporation sources. J Vac Sci Technol 10(1):100–103
Turner ME (1973) How to specify the right source to the right job. Solid State Technol 16(7):16–18
Soa EA, Persch G (1974) Die Dicke der Aufdampfschichten in ihrer Abhängigkeit von technischen Parametern. Exp Techn Phys 22(6):571–583
Erikson ED (1974) Thickness distribution of a metall – alloy from a high-rate electron beam source. J Vac Sci Technol 11(1):366–370
Mulder BJ (1977) A method for the splash-free evaporation of the aluminium and other metals. Vacuum 28(1):11–12
Kirner, K.: Reaktionen beim Verdampfen von Aluminium in Bornitridtiegeln, CVA (1970), pp. 64/65
Parent ED (1974) Power requirements of resistance-heated intermetallic evaporation sources. J Vac Sci Technol 11(4):820–822
Dobrowolzki JA (1977) Source configurations for the deposition of uniform thin films onto a moving web. In: Proc. 7th Intern. Vac. Congr. & 3rd Intern. Conf. Solid Surfaces Vienna, pp 1567–1570
Reuter W (1976) Optimierung der Verdampferanordnung bei Bandbedampfungsanlagen. Maschinenmarkt, Würzburg 82(81):1479–1482
Warren KA, Denison PR, Bills DG (1967) Resistance heated sublimator. The Review of Scientific Instruments 38(8):1019–1022
Morley JR, Smith HR (1972) High rate ion production for vacuum deposition. J Vac Sci Technol 9(6):1377–1378
Burlirsch R, Stoor J (1966) Numerical treatment of ordinary differential equations by extrapolation methods. Numer Math :1–13
Schiller S et al (1967) Erfahrungen mit einem 5-kW Elektronenstrahlverdampfer. Vakuum-Technik 16(9):205–209
Hill F (1974) Evaporated aluminium films; A review of techniques and recent improvements. Airco Temescal, Berkley, Calif
Schiller, S., et al.: Industrial electron beam coating of trep steel, In: Silva, R.M.: pp. 2d1–2d28
Groeschl ME, Benes E, Schmidt E, Siegmund H, Thorn G, Thomas FW (1989) Sensor for the detection of the incident point of an electron beam. Thin Solid Films 174:323–329
Scheibe H, Gorbunov AA, Baranova GK, Klassen NV, Konov VI, Kulakov MP, Prokhorov AM, Weis HJ (1990) Thin Film Deposition by Eximer Laser Evaporation. Thin Solid Films 189:283–291
Coutal C, Azema A, Roustan JC (1996) Thin Solid Films. Elsevier,
Barth KL, Lunk A, Ulmer J (1997) Surface and Coatings Technology. Elsevier,
Rother BJ, Siegel J, Vetter J (1990) Cathodic Arc Evaporation of Graphite with Controlled Cathode Spot Position. Thin Solid Films 188:293–300
Ehrlich H, Hasse B, Mausbach M, Müller KG (1990) The anodic vacuum arc and ist application to coating. J Vac Sci Technol A 8(3):2160–2164
Mattox DM (1973) Fundamentals of ion plating. J Vac Technol 10(1):47–52
Schwan J, Ulrich S, Roth H, Ehrhardt H (1996) Tetrahedral amorphous carbon films prepared by magnetron sputtering and dc ion plating. Journal of Applied Physics 79:
Schiller S, Heisig U, Goedicke K (1975) Alternating ion plating – a way to high rate ion vapour deposition. J Vac Sci Technol 12(4):858–864
McLeod PS, Mah G (1974) The effect of substrate bias voltage on the bonding of vaporated silver coatings. J Vac Sci Technol 11(1):119–121
Boone DH, Strangman TE, Wilson LW (1974) Some effects of structure and composition on the properties of electron beam vapour deposited coating for gas turbine superalloys. J Vac Sci Technol 11(4):641–646
Bunshah RF (1974) Structure property relationships in evaporated thick films and bulk coatings. J Vac Sci Technol 11(4):633–638
Berg RS, Kominiak GJ, Mattox DM (1974) Incorperation and behaviour of helium in ion deposited Films. J Vac Sci Technol 11(1):52–55
Jouan PY, Lempérière G (1991) Ion energy distribution at a negatively based electrode in a sputtering discharge. Vacuum 42:927–931
McNally JJ (1990) Ion assisted deposition Handbook of Plasma Processing Technology. Noyes Publications, , pp 466–482
Chambers DL, Cermichael DC (1971) Electron beam techniques for ion plating. Res And Develop 22(5):32–35
Ion assisted deposition Handbook of Plasma Processing Technology Noyes Publications (1990) pp. 466–482
Movchan BA, Demchishin AV (1969) Study of the structure and properties to thick vacuum condensates of nickel, titanium, tungsten, aluminium oxide and zirconium dioxide. Fiz Metal Metallowed 28:653–660
Thornton JA (1974) Influence of apparatus geometry and despositions conditions on the structure and topography of thick sputtered coatings. J Vac Sci Technol 11:666–670
Merssier R, Giri AP, Roy RA (1984) Revised structure zone model for thin film physical structure. J Vac Sci Technol A 2:500–503
McNally JJ (1990) Ion assisted deposition Handbook of Plasma Processing Technology. Noyes Publications, , pp 466–482
Riebeling I, Thoma K, Gärtner H (1985) Ion plating of copper layers on titanum: influence of preparation parameters and deformation on the residual stresses. Mater Sci Eng 69:435–444
Matthews A (1985) Surface Engineering 6:93–104
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Frey, H. (2015). Vacuum Evaporation. In: Frey, H., Khan, H.R. (eds) Handbook of Thin-Film Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-05430-3_3
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DOI: https://doi.org/10.1007/978-3-642-05430-3_3
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