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High-Frequency Dynamic Force Microscopy

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Applied Scanning Probe Methods V

Part of the book series: NanoScience and Technology ((NANO))

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5.4 Summary and Outlook

This chapter focused on the emerging trend of high-frequency DFM using small cantilevers or higher vibration modes. The key elements were:

  1. 1.

    Focusing of the laser beam to allow the use of micron-sized cantilevers

  2. 2.

    High-frequency detection where the signal-to-noise ratio is obtained by narrow-band homodyne methods or heterodyne methods

  3. 3.

    Photothermal excitation of the cantilever vibration, which is effective above 10 MHz, and is also effective in water for avoiding spurious signals.

  4. 4.

    Cantilever fabrication methods to realize cantilevers with a spring constant in the 100–1000N/m range, and with a natural frequency in the megahertz range.

The combination of high-frequency DFM and small and stiff cantilevers allows a wider range of imaging parameters to be chosen, resulting in higher resolution and the choice of interaction between the tip and the sample, and represents the future of DFM.

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Author information

Authors and Affiliations

  1. Institute of Industrial Science, University of Tokyo, Komaba 4-6-1, Meguro-Ku, Tokyo, 153-8505, Japan

    Hideki Kawakatsu

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  1. Hideki Kawakatsu
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Editor information

Editors and Affiliations

  1. Nanotribology Laboratory for Information Storage and MEMS/NEMS (NLIM) W390 Scott Laboratory, The Ohio State University, 201W. 19th Avenue, Columbus, Ohio, 43210-1142, USA

    Bharat Bhushan

  2. Department of Mathematics, Osaka City University, Graduate School of Science, Sugimoto 3-3-138, 558-8585, Osaka, Japan

    Satoshi Kawata

  3. Center for Nanotechnology (CeNTech) and Institute of Physics, University of Münster, Gievenbecker Weg 11, 48149, Münster, Germany

    Harald Fuchs

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© 2007 Springer-Verlag Berlin Heidelberg

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Kawakatsu, H. (2007). High-Frequency Dynamic Force Microscopy. In: Bhushan, B., Kawata, S., Fuchs, H. (eds) Applied Scanning Probe Methods V. NanoScience and Technology. Springer, Berlin, Heidelberg . https://doi.org/10.1007/978-3-540-37316-2_5

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