Abstract
Base on the LTCC technology, the high integrated circuit, the excellent performance high frequency characteristic and good reliability can be achieved. This paper depicted theoretical analysis of Balun, and simulated a integrated and small Balun by using HFSS, its center frequency is 900 MHz, band width is 120 MHz, unbalance and balance impedance are 50 Ω, the degree of phase balance is 180 ± 6°. The real Balun is manufactured by using microwave ceramics material which its dielectric constant is 8 and loss tangent is 0.0005, By comparing the results of HFSS simulation analysis with the results of experiment, it shows clearly that experimental data is consistent with simulated data. It is discussed that some should be keep watch out in the experiment and simulation, and some technique is presented to control error between experimental data with simulated data.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Sayre, C.W.: Complete Wireless Design. Publishing House of Electronics Industry, Beijing (2010)
Pang, J., Jiang, Y.: Design of planar spiral antenna and its wideband Balun. J. Microwaves s3, 128–130 (2012)
Liu, J., Wan, J., Wang, Q., Deng, P., Zhou, K., Qiao, Y.: A survey on position-based routing for vehicular ad hoc networks. Telecommun. Syst. (2015). doi:10.1007/s11235-015-9979-7
Liu, J., Wang, Q., Wan, J., Xiong, J., Zeng, B.: Towards key issues of disaster aid based on wireless body area networks. KSII Trans. Internet Inf. Syst. 7(5), 1014–1035 (2013)
Lin, Q., Zhang, Z., Zhang, B.: Microstrip Balun design. Mod. Radar 24(10), 61–63 (2004)
Jiang, W., Jin, L., Yang, S., Hu, J.: Design of a miniaturized LTCC Balun. Electron. Compon. Mater. 30(9), 53–56 (2011)
Qibo, H., Jianrong, C.: Design of wide band Balun applied to LTCC doubly balanced mixer. Space Electron. Technol. 2, 107–110 (2010)
Marchand, N.: Transmission-line conversion transformers. Electronics 17(12), 142–145 (1944)
Du, Z., Zhu, M., Zhang, H., Guo, T.: Combination of blun and filter based on UWB system. J. Microwaves 2010(8), 351–354 (2010)
Simon, W., Kulke, R., Wien, A., Rittweger, M., Wolff, I., Girard, A., Bertinet, J.-P.: Interconnects and transitions in multilayer LTCC multichip modules for 24 GHz ISM-band applications. In: IEEE MTT-S International Microwave Symposium Digest, vol. 2, pp. 1047–1050 (2000)
Yan, W., Fu, P., Hong, W.: Microwave characteristics of bonding interconnects in LTCC microwave MCM. J. Microwaves 19(3), 30–34 (2003)
Yan, W., Yu, S., Fang, X.: Three dimensional integrated microwave modules based on LTCC technology. Acta Electronica Sin. 33(11), 2009–2012 (2005)
Schmuckle, F.J., Jentzsch, A., Heinrich, W., Butz, J., Spinnler, M.: LTCC as MCM substrate: design of strip—line structure and flip-chip interconnects. In: IEEE MTT-S International Microwave Symposium Digest, vol. 2, pp. 1903–1906 (2000)
Acknowledgments
The authors would like to thank Guangdong Province Special Project of Industry-University-Institute Cooperation (No. 2014B090904080), 2013 Guangdong Province University High-level Personnel Project (Project Name: Energy-saving building intelligent management system key technologies research and development), Higher Vocational and Technical Education Research Association of Guangdong Province (No. GDGZ14Y033) and Guangdong Mechanical & Electrical College Natural Science Fund (No. YJL2014—042, No. YJKJ2015-2) for their support in this research.
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2016 ICST Institute for Computer Sciences, Social Informatics and Telecommunications Engineering
About this paper
Cite this paper
Luo, B., Liu, J., Zhang, Y., Zhang, Y., Zeng, B. (2016). A Novel Integrated GSM Balun Design and Simulation. In: Wan, J., Humar, I., Zhang, D. (eds) Industrial IoT Technologies and Applications. Industrial IoT 2016. Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering, vol 173. Springer, Cham. https://doi.org/10.1007/978-3-319-44350-8_12
Download citation
DOI: https://doi.org/10.1007/978-3-319-44350-8_12
Published:
Publisher Name: Springer, Cham
Print ISBN: 978-3-319-44349-2
Online ISBN: 978-3-319-44350-8
eBook Packages: Computer ScienceComputer Science (R0)