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Overview of Carbon Nanotube Processing Methods

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Carbon Nanotubes for Interconnects

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Abstract

On February 16, in year 2000, the first patent application was filed that proposed to use carbon nanotubes (CNTs) instead of metals as vertical interconnects in advanced microelectronic interconnects on semiconductor chips [1]. This patent, which has been cited in over 150 following patent applications as prior art, emphasizes that CNTs would be especially useful in vertical interconnects (vias). The quasi-ballistic current transport in CNTs would allow very efficient low resistance interconnects which can mitigate the observed reliability issues in advanced semiconductor interconnects [2].

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Authors and Affiliations

  1. TUM, Munich, Germany

    Franz Kreupl

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  1. Franz Kreupl
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Correspondence to Franz Kreupl .

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Editors and Affiliations

  1. CNRS-LIRMM/University of Montpellier, Montpellier, France

    Aida Todri-Sanial

  2. CEA LITEN, Grenoble, France

    Jean Dijon

  3. University of Cassino and Southern Lazio, Cassino, Italy

    Antonio Maffucci

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Kreupl, F. (2017). Overview of Carbon Nanotube Processing Methods. In: Todri-Sanial, A., Dijon, J., Maffucci, A. (eds) Carbon Nanotubes for Interconnects. Springer, Cham. https://doi.org/10.1007/978-3-319-29746-0_3

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  • DOI: https://doi.org/10.1007/978-3-319-29746-0_3

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-29744-6

  • Online ISBN: 978-3-319-29746-0

  • eBook Packages: EngineeringEngineering (R0)

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