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Electromigration

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On-Chip Power Delivery and Management

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Abstract

The power current requirements of integrated circuits are rapidly rising, as discussed in Chap. 1 and throughout this book. The current density in on-chip power and ground lines can reach several hundred thousands of amperes per square centimeter.

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Author information

Authors and Affiliations

  1. University of Rochester, Rochester, NY, USA

    Inna P.-Vaisband

  2. Qualcomm Corporation, San Diego, CA, USA

    Renatas Jakushokas

  3. Qualcomm Corporation, San Marcos, CA, USA

    Mikhail Popovich

  4. Intel Corporation, Hillsboro, ON, USA

    Andrey V. Mezhiba

  5. University of South Florida, Tampa, NY, USA

    Selçuk Köse

  6. University of Rochester, Rochester, USA

    Eby G. Friedman

Authors
  1. Inna P.-Vaisband
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  2. Renatas Jakushokas
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  3. Mikhail Popovich
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  4. Andrey V. Mezhiba
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  5. Selçuk Köse
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  6. Eby G. Friedman
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P.-Vaisband, I., Jakushokas, R., Popovich, M., Mezhiba, A.V., Köse, S., Friedman, E.G. (2016). Electromigration. In: On-Chip Power Delivery and Management. Springer, Cham. https://doi.org/10.1007/978-3-319-29395-0_4

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  • DOI: https://doi.org/10.1007/978-3-319-29395-0_4

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  • Publisher Name: Springer, Cham

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  • Online ISBN: 978-3-319-29395-0

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