Abstract
We will review the recent progresses of large-area , ultraflexible, and ultrasoft electronic sensors. This chapter focuses on integration technologies of thin-film, ultraflexible electronics comprising ultrasoft gel electrodes, thin-film amplifier, Si-LSI wireless platform, thin-film battery, and information engineering, which are imperceptible active sensors. Here we would like to demonstrate the applications of the patch-type wearable biosignal sensors including brain wave (Electroencephalogram: EEG) monitoring from a forehead. Furthermore, this chapter will review the technologies for realizing the new era of electronic system, that is, Internet of Things (IoT.)
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Acknowledgments
Part of our studies was supported by the Center of Innovation (COI) Program of Osaka University. The research was carried out in collaboration with Takafumi Uemura (specially appointed associate professor), Teppei Araki (assistant professor), and Shusuke Yoshimoto (assistant professor), Katsuaki Suganuma (professor), Kazuhiko Matsumoto (professor), Mototsugu Ogura (specially appointed professor) of the Institute of Scientific and Industrial Research of Osaka University, and members of Sekitani’s laboratory. The research on organic TFTs and their integrated circuits was carried out with the support of the Exploratory Research for Advanced Technology (ERATO) research funding program of Japan Science and Technology Agency (JST) when the author was at the University of Tokyo. I am grateful to Takao Someya (professor) and Tomoyuki Yokota (specially appointed assistant professor) of the Graduate School of Engineering of the University of Tokyo, and to Takayasu Sakurai (professor) and Makoto Takamiya (associate professor) of the Institute of Industrial Science of the University of Tokyo.
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Sekitani, T. (2016). Soft Biosensor Systems Using Flexible and Stretchable Electronics Technology. In: Rogers, J., Ghaffari, R., Kim, DH. (eds) Stretchable Bioelectronics for Medical Devices and Systems. Microsystems and Nanosystems. Springer, Cham. https://doi.org/10.1007/978-3-319-28694-5_7
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DOI: https://doi.org/10.1007/978-3-319-28694-5_7
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