General Conclusions

Abstract

The ever-increasing demand for higher data rates in wireless communication systems has driven the design of integrated RF building blocks toward the millimeter-wave frequency band. At these high frequencies, a large modulation bandwidth is available which is required to support these high data rates. The continuous scaling of CMOS technology has lead to an increase of the f$_{\mathrm{t}}$ and f$_{\mathrm{max}}$ beyond 100 GHz, enabling the implementation of such high-frequency systems in CMOS. The advantage of this high factor of integration is the capability of low-cost chip production for mass-market applications.